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Issue Date
Title
Author(s)
Supervisor(s)
2015
Solder joint reliability of Sn-Cu and Sn-Ag-Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses
Satyanarayan
;
Prabhu, K.N.
-
2013
Wetting behavior of lead-free solders on copper substrates
Satyanarayan
;
Prabhu, K.N.
-
2012
Effect of quench probe material and section size on cooling severity
Ramesh, G.
;
Prabhu, K.N.
-
2016
Effect of Ce melt treatment on solidification path of ZA8 alloy
Sudheer, R.
;
Vijeesh, V.
;
Prabhu, K.N.
-
2015
The effect of cooling rate and cerium melt treatment on thermal analysis parameters and microstructure of hypoeutectic Al-Si alloy
Vijeesh, V.
;
Prabhu, K.N.
-
2012
Wetting characteristics of sn-0.7cu lead-free solder alloy on copper substrates
Satyanarayan
;
Prabhu, K.N.
-
2015
Assessment of latent heat and solid fraction of Al-22Si alloy using Newtonian and Fourier analysis techniques
Vijayan, V.
;
Prabhu, K.N.
-
2015
Wettability and bond shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate
Tikale, S.
;
Sona, M.
;
Prabhu, K.N.
-
2016
A Computer Aided Cooling Curve Analysis method to study phase change materials for thermal energy storage applications
Sudheer, R.
;
Prabhu, K.N.
-
2016
Assessment of Joint Reliability of Sn 2.5Ag 0.5Cu Solder/Cu as a Function of Reflow Time
Sona, M.
;
Prabhu, K.N.
-
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Ramesh, G.
9
Satyanarayan
6
Vijeesh, V.
5
Sona, M.
4
Vijayan, V.
3
Kumar, G.
3
Sudheer, R.
2
Ballal, N.V.
1
Ali, I.
1
Arias-Moliz, T.
.
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