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Issue Date
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2015
Characterization of metal-PCMs for thermal energy storage applications
Sudheer, R.
;
Prabhu, K.N.
-
2015
Solder joint reliability of Sn-Cu and Sn-Ag-Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses
Satyanarayan
;
Prabhu, K.N.
-
2015
The effect of cooling rate and cerium melt treatment on thermal analysis parameters and microstructure of hypoeutectic Al-Si alloy
Vijeesh, V.
;
Prabhu, K.N.
-
2015
Assessment of latent heat and solid fraction of Al-22Si alloy using Newtonian and Fourier analysis techniques
Vijayan, V.
;
Prabhu, K.N.
-
2015
Wettability and bond shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate
Tikale, S.
;
Sona, M.
;
Prabhu, K.N.
-
2015
Comparative study of wetting and cooling performance of polymer-salt hybrid quench medium with conventional quench media
Ramesh, G.
;
Prabhu, K.N.
-
2015
Effect of chilling and cerium addition on microstructure and cooling curve parameters of Al-14%Si alloy
Vijayan, V.
;
Prabhu, K.N.
-
2015
The Effect of Addition of Ce and Sr on the Solidification Path of Al 8Si 2Cu Alloy
Vijeesh, V.
;
Prabhu, K.N.
-
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Tikale, S.