Faculty Publications

Permanent URI for this communityhttps://idr.nitk.ac.in/handle/123456789/18736

Publications by NITK Faculty

Browse

Subject: search.filters.subject.Intermetallics

Search Results

Now showing 1 - 10 of 26
  • No Thumbnail Available
    Item
    Hot dip aluminizing of 9Cr-1Mo steels and their heat treatment
    (Trans Tech Publications Ltd ttp@transtec.ch, 2015) Patel, J.; Huilgol, P.; Jamnapura, N.; Bhat, K.
    Coupons of 9Cr-1Mo steels of type SA 387 Grade 9 class 2 were hot dip aluminized using Al bath at a temperature of 700 °C for 30 seconds. The samples were further heat treated at 750 °C for durations of 1, 3 and 5 hours, respectively. The samples were characterized using X-ray diffractometry, scanning electron microscopy and energy dispersive spectroscopy. The investigation showed that as coated samples contain an aluminum top coat, a reaction layer and substrate material. Within the reaction layer, two distinct regions corresponding to Fe2Al5 and Fe4Al13 were identified. Chromium up to 2 at% was observed. After heat treatment Al coat was not existing. Two distinct layers, corresponding to a thick Fe2Al5 and a thin FeAl were observed at shorter heat treatment duration. Under longer heat treatment durations, multiple phases, namely, Fe2Al5, FeAl, Fe3Al and solid solution of Al in Fe were observed. © (2015) Trans Tech Publications, Switzerland.
  • No Thumbnail Available
    Item
    Phase transformation, structural evolution, and mechanical property of nanostructured feal as a result of mechanical alloying
    (Springer New York LLC barbara.b.bertram@gsk.com, 2009) Rajath Hegde, M.M.R.; Surendranathan, A.O.
    The objective of the work is to synthesize nanostructured FeAl alloy powder by mechanical alloying (MEA). The work concentrates on the synthesis, characterization, and structural and mechanical properties of the alloy. Nanostructured FeAl intermetallics are prepared directly by MEA in a high-energy ball mill. Milling is performed under toluene solution to avoid contamination from the milling media and atmosphere. Mixtures of elemental Fe and Al are progressively transformed into a partially disordered solid solution with an average composition of Fe-50 at.% Al. Phase transformation, structural changes, morphology, particle size measurement, and chemical composition during MEA are investigated by X ray diffraction (XRD), scanning electron microscopy (SEM), and energy dispersive x-ray spectroscopy (EDS). Vickers microhardness (VMH) indentation tests are performed on the powders. The XRD and SEM studies reveal the alloying of elemental powders as well as transition to nanostructured alloy; crystallite size of 18 nm is obtained after 28 h of milling. Expansion/contraction in lattice parameter accompanied by reduction in crystallite size occurs during transition to nanostructured alloy. Longer milling introduces ordering in the alloyed powders as proved by the presence of superlattice reflection. Elemental and alloyed phases coexist while hardness increases during MEA. copy2009 Springer Science+Business Media, Inc.
  • No Thumbnail Available
    Item
    Phase transformation, structural evolution and mechanical property of nanostructured FeAl as a result of mechanical alloying
    (2009) Rajath Hegde, M.M.R.; Surendranathan, A.O.
    Objective of the work was to synthesize nanostructured FeAl alloy powder by mechanical alloying (MEA). The work concentrated on synthesis, characterization, structural and mechanical properties of the alloy. Nanostructured FeAl intermetallics were prepared directly by MEA in a high energy rate ball mill. Milling was performed under toluene solution to avoid contamination from the milling media and atmosphere. Mixtures of elemental Fe and Al were progressively transformed into a partially disordered solid solution with an average composition of Fe-50 at % Al. Phase transformation, structural changes, morphology, particle size measurement and chemical composition during MEA were investigated by X-ray diffraction (XRD), Scanning electron microscopy (SEM) and Energy dispersive X-ray spectroscopy (EDS) respectively. Vickers micro hardness (VMH) indentation tests were performed on the powders. XRD and SEM studies revealed the alloying of elemental powders as well as transition to nanostructured alloy, crystallite size of 18 nm was obtained after 28 hours of milling. Expansion/contraction in lattice parameter accompanied by reduction in crystallite size occurs during transition to nanostructured alloy. Longer milling duration introduces ordering in the alloyed powders as proved by the presence of superlattice reflection. Elemental and alloyed phase coexist while hardness increased during MEA. © 2009 Allerton Press, Inc.
  • No Thumbnail Available
    Item
    Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures
    (ASTM International, 2011) Satyanarayan, S.; Prabhu, K.N.
    The effect of surface roughness on wetting behaviour and evolution of microstructure of two lead-free solders (Sn-2.625Ag-2.25Zn and Sn-1.75Ag-4.5Zn) on copper substrate was investigated. Both solders exhibited good wettability on copper substrates having rough surface and lower wettabilty on smooth surfaces. The contact angles of solders decreased linearly with increase in surface roughness of the substrate. The exponential power law, ?=exp(-KT -1), was used to model the relaxation behaviour of solders. A high intermetallic growth was observed at the interface particularly on copper substrates with rough surface texture. A thin continuous interface showing scallop intermetallic compounds (IMC) was obtained on smooth surfaces. With an increase in surface roughness, the IMC morphology changed from scallop shaped to needle type at the Sn-2.625Ag-2.25Zn solder/ substrate interface and nodular to plate like IMCs for Sn-1.75Ag-4.5Zn solder matrix. Copyright © 2010 by ASTM International.
  • No Thumbnail Available
    Item
    Wetting behaviour and interfacial microstructure of Sn-Ag-Zn solder alloys on nickel coated aluminium substrates
    (2011) Satyanarayan, S.; Prabhu, K.N.
    Wetting behaviours of two lead free solders (Sn-2·625Ag- 2·25Zn and Sn-1·75Ag-4·5Zn) on nickel coated aluminium substrates were investigated. Sn-2·625Ag-2·25Zn exhibited better wettability compared to Sn-1·75Ag-4·5Zn solder. Contact angles of the solders increased with increasing roughness of the substrate. The Young-Dupre equation was used to evaluate the work of adhesion of solder on the substrate. Sn-2·625Ag-2·25Zn solder exhibited higher work of adhesion than Sn-1·75Ag-4·5Zn. A thin continuous layer of Ni 3Sn was detected at the interface between Sn-2·625Ag- 2·25Zn solder and nickel coated Al substrate. Sn-1·75Ag- 4·5Zn solder exhibited scallop intermetallic compounds (IMCs) growing into the solder field as well as a thin continuous IMC in some cases. Ni 3Sn and Ni3Sn4 IMCs were observed at the interface of Sn-1·75Ag-4·5Zn solder and nickel coated Al. © 2011 Institute of Materials, Minerals and Mining.
  • No Thumbnail Available
    Item
    Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn-0.7Cu solder alloy and copper substrate
    (2012) Satyanarayan, S.; Prabhu, K.N.
    In the present work, the effect of soldering temperature (270 and 298 °C) and substrate surface texture (0.02 and 1.12 ?m) on wetting characteristics and morphology of intermetallic compounds (IMCs) between Sn-0.7Cu lead-free solder on copper substrates was investigated. It was found that increase in temperature and substrate surface roughness improved the wettability of solder alloy. However, the effect of surface roughness on wettability was significant as compared to that of temperature. The spreading of solder alloy was uniform on smooth substrate, whereas spreading of the alloy on rough substrate resulted in an oval shape. The morphology of IMCs transformed from long needle shaped to short and thick protrusions of IMCs with increase in surface roughness of the substrate. Needle shaped and thick protruded intermetallics formed at the solder/Cu interface were identified as Cu 6Sn 5 compounds. The formation of Cu 3Sn IMC was observed only for the spreading of solder alloy at 298 °C which contributed to improvement in the wettability of solder alloy on both smooth and rough substrate surfaces. © Springer Science+Business Media, LLC 2012.
  • No Thumbnail Available
    Item
    Effect of Mn on cooling behaviour and microstructure of chill cast Zn-Al (ZA8) alloy
    (2012) Ramesh, G.; Vishwanatha, H.M.; Prabhu, K.N.
    In the present work, the effect of manganese addition to ZA8 alloy on thermal analysis parameters, heat transfer and microstructure was investigated. The thermal analysis parameters were found to be significantly affected by chemical modification of ZA8 alloy. Cooling curve and differential scanning calorimetry analyses of modified alloy showed nucleation of new phase other than b dendrites. Chilling of modified alloy resulted in decreased liquidus temperature and enhanced eutectoid transformation. Further, chilling avoids the formation of intermetallic compounds in modified alloy. The heat flux transients were estimated using inverse modelling during solidification of unmodified and modified alloys against different chills. The peak heat flux decreased on addition of Mn to ZA8 alloy. Differential scanning calorimetry analysis indicated that the addition of Mn to ZA8 alloy decreases the heat of solidification. The addition of Mn to ZA8 alloy increased the contact angle, indicating decreased wettability of the modified alloy on the chill surface. The microstructure of ZA8 with Mn showed an increased amount of b phase and a decreased amount of eutectic. X-ray diffraction analysis confirmed the formation of MnAl6 intermetallics in Mn added ZA8 alloy. Chilling with chemical modification resulted in enhanced decomposition of b phase. © 2012 Institute of Materials, Minerals and Mining.
  • No Thumbnail Available
    Item
    Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate
    (Maney Publishing michael.wagreich@univie.ac.at, 2013) Satyanarayan, S.; Prabhu, K.
    In the present work, spreading behaviour and development of interfacial microstructure in Sn- 0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrates having two different surface textures were investigated. Smooth textured surfaces yielded better wettability than rough surfaces particularly for Sn-0·7Cu solder alloy. Wettability of Sn-0·7Cu solder on rough textured surfaces was found to be poor compared to other solder alloys. Spreading of Sn-0·7Cu solder on substrate surface showed longer viscous regime, Sn-2·5Ag- 0·5Cu solder exhibited shortest viscous regime. Sn-0·3Ag-0·7 solder showed intermediate behaviour. Sn-Cu solder alloy exhibited needle and coarse shaped (Cu,Ni)6Sn5 intermetallics at the interface and in the matrix of the solder alloy on smooth substrate, whereas on rough substrate, formation of only coarse shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) was observed. For Sn-0·3Ag-0·7Cu solder alloy, Fe-Ni-Sn and FeSn2 IMCs identified at the interface. (Cu,Ni)6/Sn5 IMCs were found to be less coarser than as observed at Sn-0·7Cu/substrate interface. Sn-2·5Ag-0·5Cu alloy exhibited (Cu,Ni) 3Sn4 and (Cu,Ni)6 Sn5 IMCs at the interface and in the bulk of solder alloy. © 2013 Institute of Materials, Minerals and Mining.
  • No Thumbnail Available
    Item
    Solder joint reliability of Sn-0·7Cu and Sn-0·3Ag- 0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses
    (2013) Satyanarayan, S.; Prabhu, K.
    The bond shear test was used to assess the integrity of Sn-0·7Cu and Sn-0·3Ag-0·7Cu lead-free solder alloy drops solidified on copper substrates with smooth and rough surface finishes. Solder alloys solidified on smooth substrates required higher shear force compared to that on rough substrates. Sn-0·3Ag-0·7Cu alloy required higher shear energy than Sn-0·7Cu alloy. Solder alloys solidified on smooth substrate surfaces exhibited complete ductile failure. On rough copper surfaces, solder alloys showed a transition ridge characterized by sheared intermetallic compounds (IMCs) and the presence of dimples. The peak shear strength decreased with increase in contact area of the solder bond on the substrate. Smooth surface and the presence of minor amount of Ag in the solder alloy enhance the integrity of the solder joint. © 2013 Institute of Materials, Minerals and Mining.
  • No Thumbnail Available
    Item
    Effect of chilling and cerium addition on microstructure and cooling curve parameters of Al-14%Si alloy
    (Maney Publishing maney@maney.co.uk, 2015) Vijayan, V.; Prabhu, K.
    Al-14%Si alloys, with and without cerium, were cast at varying cooling rates by solidifying them in a crucible and against chills. The effect of melt treatment and chilling on microstructure and cooling curve parameters of the alloy was assessed. Ce treated alloys solidified in clay graphite crucible at a slow cooling rate showed refinement of primary silicon and the formation of Al-Si-Ce ternary intermetallic compound. The addition of Ce to the alloy solidified against chills resulted in simultaneous refinement and modification of primary and eutectic silicon. Nucleation temperatures of both primary and eutectic silicon decreased on addition of cerium. The formation of the intermetallic compound decreased with increase in cooling rate, leading to the modification of the eutectic silicon. The increase in the degree of modification of the eutectic Si was associated with the decrease in the volume fraction of the intermetallic compound formed. © 2015 Canadian Institute of Mining, Metallurgy and Petroleum Published by Maney on behalf of the Institute.