Wetting behaviour and interfacial microstructure of Sn-Ag-Zn solder alloys on nickel coated aluminium substrates
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Date
2011
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Abstract
Wetting behaviours of two lead free solders (Sn-2·625Ag- 2·25Zn and Sn-1·75Ag-4·5Zn) on nickel coated aluminium substrates were investigated. Sn-2·625Ag-2·25Zn exhibited better wettability compared to Sn-1·75Ag-4·5Zn solder. Contact angles of the solders increased with increasing roughness of the substrate. The Young-Dupre equation was used to evaluate the work of adhesion of solder on the substrate. Sn-2·625Ag-2·25Zn solder exhibited higher work of adhesion than Sn-1·75Ag-4·5Zn. A thin continuous layer of Ni <inf>3</inf>Sn was detected at the interface between Sn-2·625Ag- 2·25Zn solder and nickel coated Al substrate. Sn-1·75Ag- 4·5Zn solder exhibited scallop intermetallic compounds (IMCs) growing into the solder field as well as a thin continuous IMC in some cases. Ni <inf>3</inf>Sn and Ni<inf>3</inf>Sn<inf>4</inf> IMCs were observed at the interface of Sn-1·75Ag-4·5Zn solder and nickel coated Al. © 2011 Institute of Materials, Minerals and Mining.
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Keywords
Al substrate, Continuous layers, IMCs, Interfacial microstructure, Lead free solders, Nickel coated, Sn-Ag-Zn, Solder alloys, Wetting behaviour, Work of adhesion, Adhesion, Aluminum, Contact angle, Intermetallics, Nickel, Nickel coatings, Silver, Silver alloys, Soldering alloys, Substrates, Wetting, Zinc, Tin
Citation
Materials Science and Technology (United Kingdom), 2011, 27, 7, pp. 1157-1162