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|Title:||Experimental investigation on boiling heat transfer coefficient enhancement using grooves for cooling of electronic devices|
|Citation:||Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2014, Vol., , pp.466-472|
|Abstract:||This paper presents the experimental investigation of pool boiling heat transfer performance of copper plain and grooved horizontal circular surfaces immersed in saturated water at atmospheric pressure. Effect of geometric parameters of the groove on boiling heat transfer coefficient was studied. Experimental results showed significant increase in boiling heat transfer coefficients at high heat flux with the provision of grooves. An increase in boiling heat transfer was observed with increase in fin thickness and groove depth. � 2014 IEEE.|
|Appears in Collections:||2. Conference Papers|
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