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|Title:||Influences of dielectric and conductive fillers on dielectric and mechanical properties of solid silicone rubber composites|
|Citation:||Iranian Polymer Journal (English Edition), 2019, Vol.28, 7, pp.563-573|
|Abstract:||Dielectric elastomers are materials being used for electromechanical transduction applications. Their electromechanical response depends on permittivity, Young s modulus and electric breakdown strength. A factor that limits its application is high operating voltages that can be reduced through improvement in permittivity. One of the methods is by incorporating high permittivity fillers into polymer matrix to obtain dielectric dielectric composites (DDC).These composites show high permittivity at the cost of reduced flexibility. An alternative solution is development of composites by incorporating organic or inorganic conductive fillers into polymer matrix. These composites show high permittivity with high dielectric loss and low breakdown strength. To overcome both the above limitations both dielectric and conductive fillers are incorporated into dielectric polymer matrix to obtain conductor dielectric composites (CDC). In this study, high temperature vulcanized solid silicone rubber as matrix has been used to prepare DDC composites with barium titanate (BT) filler and CDC composites with both BT as dielectric and ketjenblack as conductive fillers, using Taguchi design of experiments. The effect of factors such as amount of fillers and curing agent, mixing time in roll mill and curing temperature on the dielectric and mechanical properties are reported. Lichtenecker model predicts the permittivity of the DDC composite more accurately. For the CDC composites permittivity increased by 390%, effective resistivity decreased by 80%, Young s modulus increased by 368% and Shore A hardness increased by 90% as compared to those of reference matrix. Important interaction effects are observed among both the fillers that are uniformly dispersed without any aggregation. 2019, Iran Polymer and Petrochemical Institute.|
|Appears in Collections:||1. Journal Articles|
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