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Title: Determination of coupling factors for adhesive-bonded plates
Authors: Pankaj, A.C.
Murigendrappa, S.M.
Issue Date: 2016
Citation: ARPN Journal of Engineering and Applied Sciences, 2016, Vol.11, 12, pp.7968-7972
Abstract: Adhesive bonding has gained importance in structural bonding in aircraft industry as an alternative method of joining materials together over the more conventional joining methods. It is gaining interest due to the increasing demand for joining similar or dissimilar structural components, mostly within the framework of designing light weight structures. In this present study, a finite element model of a structure, consisting of two Acrylic/Perspex plates joined by an adhesive has been modeled using ANSYS software. Comparisons have been made for the computed coupling factors and velocity responses for the adhesive bonded plates using finite element method and analytical wave approach of the same plates for a line junction at the joint. The results obtained from the studies signify the importance of modeling of adhesive joints in computation of the coupling factors and its further use in computation of energies and velocity responses using statistical energy approach as compared to the values obtained using analytical wave approach for a continuous line junction. Coupling factors have been computed from the velocity responses for the adhesive bonded plates using finite element method and compared with the values obtained from the analytical wave approach for the same plates with a line junction at the joint. 2006-2016 Asian Research Publishing Network (ARPN).
Appears in Collections:1. Journal Articles

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