Please use this identifier to cite or link to this item: https://idr.nitk.ac.in/jspui/handle/123456789/10283
Title: Comparison of fluid flow and heat transfer through metal foams and wire mesh by using CFD
Authors: Kotresha, B.
Gnanasekaran, N.
Issue Date: 2019
Citation: Recent Patents on Mechanical Engineering, 2019, Vol.12, 3, pp.220-226
Abstract: Background: The unique structural characteristics of the metal foams, such as low density, large surface area, ability to increase turbulence, and increased heat transfer efficiency, are the advantages associated with thermal applications such as electronics cooling, refrigeration air conditioning, etc. The porous metal foam structures are extensively used to enhance heat transfer. Objective: This paper discusses the numerical simulations of a vertical channel filled with metal foam and wire mesh. The fluid flow and heat transfer phenomena of a wire mesh are compared with two different types of metal foams. Metal foams are made of aluminium and copper while the wire mesh is made of brass. The porosity of the metallic porous structures varies from 0.85 to 0.95. Methods: A Darcy extended Forchheirmer model is considered for solving fluid flow through the porous media while the heat transfer through the porous media is predicted using local thermal non-equilibrium model. Results: Initially, the results obtained using the proposed numerical procedures are compared with experimental results available in the literature. The numerical simulations suggest that the pressure drop increases as the velocity of the fluid increases and decreases as the porosity increases. The heat transfer coefficient and Nusselt number are determined for both the metal foams and the wire mesh. Conclusion: The Nusselt number obtained for wire mesh shows almost 90% of the copper metal foam in the same porosity range. The numerical results suggest that the brass wire mesh porous medium can also be used for enhancement of heat transfer. In this article, patents have been discussed. 2019 Bentham Science Publishers.
URI: http://idr.nitk.ac.in/jspui/handle/123456789/10283
Appears in Collections:1. Journal Articles

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