Browsing by Author Prabhu, K.N.

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Issue DateTitleAuthor(s)Supervisor(s)
2013Effect of purging gas on wetting behavior of Sn-3.5Ag lead-free solder on nickel-coated aluminum substratePrabhu, K.N.; Varun, M.; Satyanarayan-
2012Effect of quench probe material and section size on cooling severityRamesh, G.; Prabhu, K.N.-
2014Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bondsBhat, K.N.; Prabhu, K.N.; Satyanarayan-
2014The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn-Cu solder alloySona, M.; Prabhu, K.N.-
2016Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper SubstratesSona, M.; Prabhu, K.N.-
2007Effect of section size and agitation on heat transfer during quenching of AISI 1040 steelFernandes, P.; Prabhu, K.N.-
2006Effect of section thickness and modification on thermal analysis parameters of A357 alloyHegde, S.; Kumar, G.; Prabhu, K.N.-
2018Effect of section thickness on heat transfer during quenching in vegetable oilsNayak, U.V.; Prabhu, K.N.-
2016The effect of simultaneous refinement and modification by cerium on microstructure and mechanical properties of Al-8% Si alloyVijayan, V.; Prabhu, K.N.-
2018The effect of Sr modification on thermal diffusivity of Al 8Si alloyVijayan, V.; Prabhu, K.N.-
2013The effect of strontium modification on casting/chill interfacial heat flux and casting surface profile during solidification of Al-7Si alloyVijeesh, V.; Prabhu, K.N.-
2009Effect of substrate surface roughness on wetting behaviour of vegetable oilsPrabhu, K.N.; Fernades, P.; Kumar, G.-
2004Effect of substrate surface texture and flux coating on the evolution of microstructure during solidification of lead free Sn-3.5Ag solder alloyPrabhu, K.N.; Bali, R.; Ranjan, R.-
2004Effect of superheat, mold, and casting materials on the metal/mold interfacial heat transfer during solidification in graphite-lined permanent moldsPrabhu, K.N.; Suresha, K.M.-
2007Effect of surface roughness on metal/quenchant interfacial heat transfer and evolution of microstructurePrabhu, K.N.; Fernandes, P.-
2012Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn-0.7Cu solder alloy and copper substrateSatyanarayan; Prabhu, K.N.-
2019The Effect of Thermal Ageing on Solder/Substrate Interfacial Microstructures During Reflow of Sn 37Pb and Sn 3Ag 0.5CuSatyanarayan; Kumarswamy, M.C.; Prabhu, K.N.-
2007Effect of thermal contact heat transfer on solidification of Pb-Sn and Pb-free soldersChellaih, T.; Kumar, G.; Prabhu, K.N.-
2006Effect of volume fraction and particle size of reinforcement on thermal analysis and heat transfer parameters of gravity die cast hypereutectic Al-22% SI alloy matrix compositesSubramanya, P.K.; Hegde, S.; Prabhu, K.N.-
2017The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap JointsSona, M.; Prabhu, K.N.-