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|Title:||The Effect of Thermal Ageing on Solder/Substrate Interfacial Microstructures During Reflow of Sn 37Pb and Sn 3Ag 0.5Cu|
|Citation:||Transactions of the Indian Institute of Metals, 2019, Vol.72, 6, pp.1545-1549|
|Abstract:||In the current study, the influence of thermal ageing on evolution of microstructures in the interfacial region between solders (Sn 37Pb, Sn 3.5Ag 0.5Cu) and copper substrates was investigated. Pb-containing and Pb-free solders were reflowed on Cu substrates at 230 C for 15 min and were isothermally aged at 100 C for 24 h. As-reflowed Sn Pb solder/Cu substrate interfacial region exhibited continuous and layered type of IMC at the interface, and this IMC morphology changed to scallop type with isothermal ageing. SAC solder/Cu as-reflowed samples showed continuous and needle-shaped Cu6Sn5 and Ag3Sn IMCs at the interface. However, in an isothermally aged condition, plate-shaped Cu6Sn5 and flower-shaped Ag3Sn IMCs were found inside the solder matrix. Scanning electron microscopic (SEM) study showed that the thickness of Cu6Sn5 IMC was higher in reflowed Sn Pb/Cu region than in SAC/Cu region. 2019, The Indian Institute of Metals - IIM.|
|Appears in Collections:||1. Journal Articles|
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