Faculty Publications
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Item Item Determination of spread activation energy and assessment of wetting behavior of solders on metallic substrates(American Society of Mechanical Engineers (ASME), 2010) Prabhu, K.N.; Kumar, G.The effects of substrate material, substrate surface roughness, and operating temperature on the wetting behavior of Sn-37Pb, Sn-3.5Ag, and Sn-9Zn eutectic solders on metallic substrates were investigated. Solder spreading kinetics was successfully represented by the exponential power law (EPL): ?=exp (-K ?n). The EPL parameter K has the significance of accelerating the kinetics of relaxation while the parameter n represents the resistance to spreading process (spread resistance parameter). EPL parameters exhibited a decreasing trend with an increase in surface roughness. Estimated activation energies for solder spreading were found to be in between those reported for inert and highly reactive spreading systems. © 2010 American Society of Mechanical Engineers.Item Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature(Elsevier Ltd, 2012) Prabhu, K.N.; Deshapande, P.; Satyanarayan, S.Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT. © 2011 Elsevier B.V.Item Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate(Maney Publishing michael.wagreich@univie.ac.at, 2013) Satyanarayan, S.; Prabhu, K.In the present work, spreading behaviour and development of interfacial microstructure in Sn- 0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrates having two different surface textures were investigated. Smooth textured surfaces yielded better wettability than rough surfaces particularly for Sn-0·7Cu solder alloy. Wettability of Sn-0·7Cu solder on rough textured surfaces was found to be poor compared to other solder alloys. Spreading of Sn-0·7Cu solder on substrate surface showed longer viscous regime, Sn-2·5Ag- 0·5Cu solder exhibited shortest viscous regime. Sn-0·3Ag-0·7 solder showed intermediate behaviour. Sn-Cu solder alloy exhibited needle and coarse shaped (Cu,Ni)6Sn5 intermetallics at the interface and in the matrix of the solder alloy on smooth substrate, whereas on rough substrate, formation of only coarse shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) was observed. For Sn-0·3Ag-0·7Cu solder alloy, Fe-Ni-Sn and FeSn2 IMCs identified at the interface. (Cu,Ni)6/Sn5 IMCs were found to be less coarser than as observed at Sn-0·7Cu/substrate interface. Sn-2·5Ag-0·5Cu alloy exhibited (Cu,Ni) 3Sn4 and (Cu,Ni)6 Sn5 IMCs at the interface and in the bulk of solder alloy. © 2013 Institute of Materials, Minerals and Mining.Item Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates(Springer New York LLC barbara.b.bertram@gsk.com, 2016) Sona, M.; Prabhu, K.N.The effect of reflow time on wetting behavior of Sn-2.5Ag-0.5Cu lead-free solder on bare and nickel-coated copper substrates has been investigated. The solder alloy was reflowed at 270°C for various reflow times of 10 s, 100 s, 300 s, and 500 s. On bare copper substrate, the intermetallic compound (IMC) thickness increased with increase in reflow time, whereas on Ni-coated Cu substrate, the IMC thickness increased up to 300 s followed by a drop for solder alloy reflowed for 500 s. The spreading behavior of the solder alloy was categorized into capillary, gravity (diffusion), and viscous zones. Gravity zone was obtained from 3.8 ± 0.43 s to 38.97 ± 3.38 s and from 5.99 ± 0.5 s to 77.82 ± 8.84 s for the Sn-2.5Ag-0.5Cu/Cu and Sn-2.5Ag-0.5Cu/Ni/Cu system, respectively. Sn-2.5Ag-0.5Cu solder alloy was also reflowed for the period corresponding to the end of the gravity zone (40 s and 80 s on bare and Ni-coated Cu, respectively). The joint strength was maximum at reflow time of 40 s and 80 s for the Sn-2.5Ag-0.5Cu/Cu and Sn-2.5Ag-0.5Cu/Ni/Cu system, respectively. The dynamic contact angle at the end of the gravity (diffusion) zone (?gz) was found to be a better parameter compared with the stabilized contact angle (?f) to assess the effect of the wettability of the liquid solder on the microstructure and joint strength. The present investigation reveals the significance of the gravity zone in assessment of optimum reflow time for lead-free solder alloys. © 2016, The Minerals, Metals & Materials Society.Item The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints(Springer New York LLC barbara.b.bertram@gsk.com, 2017) Sona, M.; Prabhu, K.N.The failure of solder joints due to imposed stresses in an electronic assembly is governed by shear bond strength. In the present study, the effect of wetting gravity regime on single-lap shear strength of Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu solder alloys reflowed between bare copper substrates as well as Ni-coated Cu substrates was investigated. Samples were reflowed for 10 s, Tgz (time corresponding to the end of gravity regime) and 100 s individually and tested for single-lap shear strength. The single-lap shear test was also carried out on eutectic Sn-Pb/Cu- and Sn-Pb/Ni-coated Cu specimens to compare the shear strength values obtained with those of lead-free alloys. The eutectic Sn-Pb showed significantly higher ultimate shear strength on bare Cu substrates when compared to Sn-Ag-Cu alloys. However, SAC alloys reflowed on nickel-coated copper substrate exhibited higher shear strength when compared to eutectic Sn-Pb/Ni-coated Cu specimens. All the substrate/solder/substrate lap joint specimens that were reflowed for the time corresponding to the end of gravity regime exhibited maximum ultimate shear strength. © 2017, ASM International.Item Simultaneous estimation of unknown parameters using a-priori knowledge for the estimation of interfacial heat transfer coefficient during solidification of Sn–5wt%Pb alloy—an ANN-driven Bayesian approach(Springer, 2019) Vishweshwara, P.S.; Gnanasekaran, N.; Arun, M.The present methodology focuses on model reduction in which the prevalent one-dimensional transient heat conduction equation for a horizontal solidification of Sn–5wt%Pb alloy is replaced with Artificial Neural Network (ANN) in order to estimate the unknown constants present in the interfacial heat transfer coefficient correlation. As a novel approach, ANN-driven forward model is synergistically combined with Bayesian framework and Genetic algorithm to simultaneously estimate the unknown parameters and modelling error. Gaussian noise is then added to the temperature distribution obtained using the forward approach to represent real-time experiments. The hallmark of the present work is to reduce the computational time of both the forward and the inverse methods and to simultaneously estimate the unknown parameters using a-priori engineering knowledge. The results of the present methodology prove that the simultaneous estimation of unknown parameters can be effectively obtained only with the use of Bayesian framework. © 2019, Indian Academy of Sciences.Item Improving the: ZT of SnTe using electronic structure engineering: Unusual behavior of Bi dopant in the presence of Pb as a co-dopant(Royal Society of Chemistry, 2021) Shenoy, U.S.; Bhat, D.K.Electronic structure engineering of SnTe by doping various elements to improve its figure of merit has been the most promising approach recently sought after. Pb doped in SnTe is well known to decrease the thermal conductivity but fails to beneficially tune its electronic properties. Herein, we co-dope Bi in SnTe doped with Pb, to improve the power factor of the material. Bi in the presence of Pb exhibits unusual features not shown in the case of Bi doped SnTe. The synergistic action leads to an increase in the band gap and valence band convergence. Bi also introduces resonance states just below the conduction band edge and causes conduction band convergence. An enhanced power factor due to modification of the electronic structure combined with reduced thermal conductivity translates into an enhanced figure of merit of up to ?1.58 at 800 K as predicted using Boltzmann transport calculations, making it a potential thermoelectric material worthy of further study. This journal is © The Royal Society of Chemistry.Item Synergistic manifestation of band and scattering engineering in the single aliovalent Sb alloyed anharmonic SnTe alloy in concurrence with rule of parsimony(Royal Society of Chemistry, 2021) Basu, R.; Mandava, S.; Shenoy, U.S.; Bhat, D.K.; Khasimsaheb, B.; Debnath, A.K.; Singh, A.; Neeleshwar, S.Several endeavors were adapted to improve the thermoelectric performance of SnTe as a substitute of toxic PbTe and the booming approaches comprise introduction of nanostructuring, resonance states, valence band convergence and interstitial or substitutional defects. In this study, a stratagem was designed to incorporate single aliovalent Sb in SnTe by a one-step approach which successfully modulates the electronic and thermal transport properties by integration of several approaches, viz. energy-filtering effect, valence band convergence and phonon scattering at all length scales synergistically. Here, the alteration of the band structure of SnTe incorporated with Sb leads to substantial improvement of the Seebeck coefficient, essentially beneficial for the performance of thermoelectric alloys, beyond the designated critical temperature at 473 K which shows the onset of strong contribution of the heavy (?) valence band. The experimental finding of band convergence by Sb was for the first time corroborated by theoretical validation by Density Functional Theory (DFT) calculations. In addition, the presence of mass fluctuation, secondary precipitates, interfaces and the long-range interactions due to resonant bonding leading to optical phonon softening, large phase space available for three-phonon scattering and strong anharmonicity enables an ultralow lattice thermal conductivity of ?0.5 W m-1 K-1. Thus, a zT value of ?0.72 at 775 K is recorded for the SnTeSb0.05 composition, which is 154% enhancement compared to our pristine SnTe and is strongly competing with numerous reported zT values using considerably less abundant Ag, Ge, In and highly toxic Pb, Hg, Bi, Cd multiple elements as either a dopant or an additive. Thus, the law of parsimony is maintained with reduction in the cost of the thermoelectric module. © The Royal Society of Chemistry.Item Isothermal oxidation behavior of As-deposited and HIPed Ti-48Al-2Cr-2Nb alloy processed using Electron Beam Powder Bed Fusion(Elsevier Ltd, 2025) Gurugubelli, R.C.; Balla, V.K.; Rajasekaran, B.; Krishna, P.; Bontha, S.This work focuses on oxidation behavior of Electron Beam Powder Bed Fusion (EB-PBF) processed Ti-48Al-2Cr-2Nb at elevated temperatures. Two different sample conditions were considered: As-deposited (AD) and post-processed by hot isostatic pressing (HIPed). The oxidation studies were carried out at 750 °C, 850 °C, and 950 °C for 30, 60, and 100 h. The oxidized samples were analyzed for oxide layer growth and kinetics using Field Emission Scanning Electron Microscopy (FESEM), Energy Dispersive X-ray Spectroscopy (EDS), Raman Spectroscopy, and X-ray Diffraction (XRD) techniques. Results indicate that oxide layers are composed of alternative bands of TiO2 and Al2O3. These oxide layers spalled at 850 °C and 950 °C after an exposure of 100 h. The HIPed samples exhibited superior oxidation resistance when compared to AD samples, with an oxidation rate constant of 0.134 mg2 cm4 h?1 at 950 °C (100 h). The presence of homogenized microstructure with large nano-scale lamellar colonies aided in uniform oxide layer growth. EB-PBF samples exhibit fine fully lamellar microstructure due to the rapid heating and cooling cycles. Hence EB-PBF (AD and HIPed) samples exhibited better oxidation resistance when compared to conventionally processed Ti-48Al-2Cr-2Nb. © 2025 Elsevier B.V.