Faculty Publications
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Item Multi-objective optimization of various type finned heat sink with phase change materials (PCM)(Institute of Physics, 2022) Muthamil Selvan, N.; Trilok, G.; Gnanasekaran, N.The paper focuses on optimizing hybrid PCM filled heat sinks with a multi-objective approach. In the current study, the fins are oriented both horizontally at the sidewalls and vertically at the bottom side in the enclosure. Two heat sinks with different types of fin shapes are introduced in the enclosure. A rectangular shape finned heat sink, and a tapered shape finned heat sink is incorporated in both sidewalls and bottom walls. The study's main goal is to optimize the PCM-based heat sink to prolong the charging cycle (melting) and shorten the discharging cycle (solidification). The PCM used in the study is n-eicosane, and the material for the heat sink is aluminum. A heat flux with constant supply of 2000 W/m2 is provided at the enclosure bottom, and the remaining walls are insulated. A 2-D numerical simulation is done using the commercial software ANSYS Fluent. The multi-objective optimization is carried out using the technique for order preference by similarity to ideal solution (TOPSIS) optimization technique. For a constant PCM volume for both the cases, fin spacing, fin positioning, and fin heights are varied. The output results determined the optimum configuration for the stretched melting period and minimized solidification period. © Published under licence by IOP Publishing Ltd.Item Effective heat transfer enhancement for high-efficient electronic cooling: a review(Springer Science and Business Media B.V., 2025) Ahmed, K.R.A.; Kumar, J.P.N.; Shyam, A.; Arumuga Perumal, D.A.; Ramalingam, R.The present review article sparks the technology of past and recent state-of-the-art trends in the field of thermal management to increase the thermal conductance with various cooling methodologies in the field of electronic cooling. Due to rapid growth in electronic industry, miniaturization of silicon components and improved performance has made the high power electronic systems to shrink in size. In order to satisfy the performance standards of sensitive electronic systems in different environmental conditions, the use of thermal enhancement technique is necessary and it is a prerequisite. This article establishes the outcomes of various experimental and numerical studies related to natural convection, forced convection and other state-of-the-art cooling technologies that are in use, with the heat flux removal ranging from 155–1550 Wm−2 with natural convection to 15,500–14,00,000 Wm−2 for liquid evaporation. Also, the work explores the investigation and development in various aspects of cooling and the factors associated with it to optimize the system. The outcomes highlight the potential of cooling technology to be adopted in wide area of applications and its capability to improve the thermal management in order to reduce energy consumption. The enhancement techniques are summarized and illustrated. The corollary of this review will be helpful in selecting the thermal enhancement method to be used for improving the thermal performance of the electronic devices. © Akadémiai Kiadó Zrt 2025.Item Nucleate pool boiling heat transfer from a flat-plate grooved surface(Begell House Inc. orders@begellhouse.com, 2015) Sathyabhama, S.This paper presents the experimental investigation of pool boiling heat transfer performance of copperplain and grooved horizontal circular surfaces immersed in saturated water at atmospheric pressure. The effect of the geometric parameters of the groove on boiling heat transfer was studied. From the experimental results, it was observed that the enhanced surfaces have a positive effect on the heat dissipation and the effect is greater than in the case of a plain surface. It was found that the heat dissipation increases with increasing groove depth, decreasing groove angle, and decreasing channel width. The improved heat transfer is attributed to improved bubble dynamics, which are a function of the heat transfer area, bubble escape resistance, and capillary force. The dominance of any of these factors over the other depends on a particular specimen. The modified Rohsenow correlation predicts the present experimental data with an error of ±20%. © 2015 by Begell House, Inc.Item Augmentation of heat transfer coefficient in pool boiling using compound enhancement techniques(Elsevier Ltd, 2017) Sathyabhama, A.; Dinesh, A.Modern compact electronic chip design demands more efficient and innovative cooling techniques in a limited space. One such method is the immersion cooling by pool boiling heat transfer, which is a highly efficient technique when compared with conventional cooling techniques. The boiling heat transfer coefficient can be enhanced using active and passive techniques. In the present investigation grooves as passive and surface vibration as active techniques were coupled to improve the boiling heat transfer coefficient. The forced vertical vibrations were induced on the copper grooved surface with a mechanical vibrator. The frequency of vibration was varied in the range 0–100 Hz and the amplitude of vibration was varied in the range 0–2.5 mm. The compound technique gave 62% improvement in heat transfer coefficient at 300 kW/m2 heat flux compared to the 29% enhancement due to grooves alone and 10% enhancement due to vibration alone. The experimental results were used to develop a modified Rohsenow correlation which predicts the experimental Nusselt number with an accuracy of ±25%. Boiling visualization was performed and the bubble parameters such as bubble departure diameter, bubble frequency and bubble growth were determined. The bubble departure diameter decreased by almost 36% and the bubble frequency increased by 221% for boiling on vibrated grooved surface. © 2017 Elsevier LtdItem Investigation on the performance of valveless pump for microdelivery of the fluid, fabricated using tool-based micromachining setup(World Scientific Publishing Co. Pte Ltd wspc@wspc.com.sg, 2017) Veeresha, R.K.; Rao, M.; Rao, R.; Tauro, A.M.Micropump is an integrated part of microfluidic system and is a boon to the field of miniaturization, owing to its helping hand in numerous applications mainly in biomedical, electronic cooling, fuel cells, spacecraft, etc. In this paper, an attempt is made to design and fabricate valveless pump, with active and passive valves. The actuation element used is piezowafer, piezowafer was experimentally tested and compared with simulated values from ANSYS for its peak displacement and these displacements were used to find volume pumped by pump. The pumping volumes found by experimentation are in good agreement with the simulated results. Further fabrication of valveless pump is carried out by using tool-based micromachining center which is a novel type of fabrication technique in micromachining. Through experiments, the optimum frequency of the pump was found to be 60Hz at an actuating voltage of 150V. The maximum head that a pump could pump was found to be 0.051m with pressure of 500.13Pa. The flow rate of the pump had a decreasing trend with increase in head. © 2017 World Scientific Publishing Company.Item Comparison of fluid flow and heat transfer through metal foams and wire mesh by using CFD(Bentham Science Publishers, 2019) Kotresha, B.; Gnanasekaran, N.Background: The unique structural characteristics of the metal foams, such as low density, large surface area, ability to increase turbulence, and increased heat transfer efficiency, are the advantages associated with thermal applications such as electronics cooling, refrigeration air conditioning, etc. The porous metal foam structures are extensively used to enhance heat transfer. Objective: This paper discusses the numerical simulations of a vertical channel filled with metal foam and wire mesh. The fluid flow and heat transfer phenomena of a wire mesh are compared with two different types of metal foams. Metal foams are made of aluminium and copper while the wire mesh is made of brass. The porosity of the metallic porous structures varies from 0.85 to 0.95. Methods: A Darcy extended Forchheirmer model is considered for solving fluid flow through the porous media while the heat transfer through the porous media is predicted using local thermal non-equilibrium model. Results: Initially, the results obtained using the proposed numerical procedures are compared with experimental results available in the literature. The numerical simulations suggest that the pressure drop increases as the velocity of the fluid increases and decreases as the porosity increases. The heat transfer coefficient and Nusselt number are determined for both the metal foams and the wire mesh. Conclusion: The Nusselt number obtained for wire mesh shows almost 90% of the copper metal foam in the same porosity range. The numerical results suggest that the brass wire mesh porous medium can also be used for enhancement of heat transfer. In this article, patents have been discussed. © 2019 Bentham Science Publishers.Item Effect of thickness and thermal conductivity of metal foams filled in a vertical channel – a numerical study(Emerald Publishing, 2019) Kotresha, B.; Gnanasekaran, N.Purpose: This paper aims to discuss about the two-dimensional numerical simulations of fluid flow and heat transfer through high thermal conductivity metal foams filled in a vertical channel using the commercial software ANSYS FLUENT. Design/methodology/approach: The Darcy Extended Forchheirmer model is considered for the metal foam region to evaluate the flow characteristics and the local thermal non-equilibrium heat transfer model is considered for the heat transfer analysis; thus the resulting problem becomes conjugate heat transfer. Findings: Results obtained based on the present simulations are validated with the experimental results available in literature and the agreement was found to be good. Parametric studies reveal that the Nusselt number increases in the presence of porous medium with increasing thickness but the effect because of the change in thermal conductivity was found to be insignificant. The results of heat transfer for the metal foams filled in the vertical channel are compared with the clear channel in terms of Colburn j factor and performance factor. Practical implications: This paper serves as the current relevance in electronic cooling so as to open up more parametric and optimization studies to develop new class of materials for the enhancement of heat transfer. Originality/value: The novelty of the present study is to quantify the effect of metal foam thermal conductivity and thickness on the performance of heat transfer and hydrodynamics of the vertical channel for an inlet velocity range of 0.03-3 m/s. © 2018, Emerald Publishing Limited.Item Numerical consideration of LTNE and darcy extended forchheimer models for the analysis of forced convection in a horizontal pipe in the presence of metal foam(American Society of Mechanical Engineers (ASME), 2021) Jadhav, P.H.; Gnanasekaran, N.; Arumuga Perumal, D.The intent of the current research work is to emphasize the computational modeling of forced convection heat dissipation in the presence of high porosity and thermal conductivity metallic foam in a horizontal pipe for different regimes of the fluid flow for a range of Reynolds number. A two-dimensional physical domain is considered in which Darcy extended Forchheimer (DEF) model is adopted in the aluminum metallic foam to predict the features of fluid flow and local thermal nonequilibrium (LTNE) model is employed for the analysis of heat transfer in a horizontal pipe for different flow regimes. The numerical results are initially matched with experimental and analytical results for the purpose of validation. The average Nusselt number for fully filled foam is found to be higher compared to other filling rate of metallic foams and the clear pipe at the cost of pressure drop. As an important finding, it has been observed that the laminar and transition flow gives higher heat transfer enhancement ratio and thermal performance factor compared to turbulent flow. This work resembles numerous industrial applications such as solar collectors, heat exchangers, electronic cooling, and microporous heat exchangers. The novelty of the work is the selection of suitable flow and thermal models in order to clearly assimilate the flow and heat transfer in metallic foam. The presence of aluminum metal foam is highlighted for the augmentation of heat dissipation in terms of PPI and porosity. The parametric study proposed in this work surrogates the complexity and cost involved in developing an expensive experimental setup. © 2021 American Society of Mechanical Engineers (ASME). All rights reserved.Item Numerical analysis of multiple phase change materials based heat sink with angled thermal conductivity enhancer(Elsevier Ltd, 2022) Nedumaran, M.; Gnanasekaran, G.; Hooman, K.Phase change materials (PCM) RT-28HC, RT-35HC, and RT-44HC with three different melting temperatures, 29 °C, 36 °C, and 44 °C, with similar thermal properties, are considered. The PCM is oriented from the left to right side of the heat sink in its increasing order. The fins are attached to the heat sink longitudinally, and its orientation effects are studied low (100–500 W/m2) and high (1000–5000 W/m2) heat fluxes applied on the horizontal bottom surface of the heat sink. A 2D model is developed using ANSYS Fluent 19, and the fin orientation effects are investigated numerically. The orientation of fins at different angles such as 0°, +15°, +30°, +45°, +60°,-15°,-30°,-45°, −60° are considered. The effect of fins on the charging cycle is assessed by comparing a single and double PCM heat sink. Three initial conditions are investigated by altering the initial temperature 300 K, 303 K, and 310 K. At increasing heat input, the negative angled fins possess a higher melting rate. For different initial conditions, −60° provides higher enhancement, and +60° possesses prolonged melting for almost all cases. The performance of a triple PCM design is compared with single and double PCM counterparts under similar conditions. © 2022 The AuthorsItem Integrated microchannel cooling for densely packed electronic components using vanadium pentaoxide (V2O5)-xerogel nanoplatelets-based nanofluids(Springer Science and Business Media B.V., 2023) Narendran, G.; Gnanasekaran, N.; Arumuga Perumal, D.A.; Moolayadukkam, M.; Nagaraja, H.S.The present study reports the implementation of novel nanoplatelets-based vanadium pent oxide (V2O5)-xerogel for the application of conjugate cooling in densely packed electronic devices. An integrated heat sink is made up of copper with a channel width of 490 µm and is shrink-fitted into aluminium block that acts as a heat spreader. V2O5-xerogel is synthesized by melt quenching process and characterized based on field emission scanning electron microscope, transmission electron microscope, and X-ray diffraction to analyse the surface morphology of the particles. Studies related to the stability of the nanofluids for different concentrations are discussed in this paper. Furthermore, a study on the effect of pulsating flow in microchannel is performed for different flow rates. As a result, a maximum enhancement of 17% in heat transfer coefficient was observed for the concentration of 0.4 mass% with a flow rate of 200 mL min-1 compared to a pure fluid. Finally, the results reveal that the xerogel is a potential working fluid for heat transfer applications involving microscale devices. © 2023, Akadémiai Kiadó, Budapest, Hungary.