Effective heat transfer enhancement for high-efficient electronic cooling: a review

Abstract

The present review article sparks the technology of past and recent state-of-the-art trends in the field of thermal management to increase the thermal conductance with various cooling methodologies in the field of electronic cooling. Due to rapid growth in electronic industry, miniaturization of silicon components and improved performance has made the high power electronic systems to shrink in size. In order to satisfy the performance standards of sensitive electronic systems in different environmental conditions, the use of thermal enhancement technique is necessary and it is a prerequisite. This article establishes the outcomes of various experimental and numerical studies related to natural convection, forced convection and other state-of-the-art cooling technologies that are in use, with the heat flux removal ranging from 155–1550 Wm−2 with natural convection to 15,500–14,00,000 Wm−2 for liquid evaporation. Also, the work explores the investigation and development in various aspects of cooling and the factors associated with it to optimize the system. The outcomes highlight the potential of cooling technology to be adopted in wide area of applications and its capability to improve the thermal management in order to reduce energy consumption. The enhancement techniques are summarized and illustrated. The corollary of this review will be helpful in selecting the thermal enhancement method to be used for improving the thermal performance of the electronic devices. © Akadémiai Kiadó Zrt 2025.