Faculty Publications
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Item Modification of eutectic silicon in Al-Si alloys(2008) Hegde, S.; Prabhu, K.N.The mechanical properties of Al-Si alloys are strongly related to the size, shape and distribution of eutectic silicon present in the microstructure In order to improve mechanical properties, these alloys are generally subjected to modification melt treatment, which transforms the acicular silicon morphology to fibrous one resulting in a noticeable improvement in elongation and strength. Improper melt treatment procedures, fading and poisoning of modifiers often result in the structure which is far from the desired one. Hence it is essential to assess the effectiveness of melt treatment before pouring. A much investigated reliable thermal analysis technique is generally used for this purpose. The deviation from the standard curve in thermal analysis helps in assessing the level of refinement of the Si structure. In the present review an attempt is made to discuss various aspects of modification, including mechanism, interaction of defects and non-destructive assessment by thermal analysis. © 2008 Springer Science+Business Media, LLC.Item Determination of spread activation energy and assessment of wetting behavior of solders on metallic substrates(American Society of Mechanical Engineers (ASME), 2010) Prabhu, K.N.; Kumar, G.The effects of substrate material, substrate surface roughness, and operating temperature on the wetting behavior of Sn-37Pb, Sn-3.5Ag, and Sn-9Zn eutectic solders on metallic substrates were investigated. Solder spreading kinetics was successfully represented by the exponential power law (EPL): ?=exp (-K ?n). The EPL parameter K has the significance of accelerating the kinetics of relaxation while the parameter n represents the resistance to spreading process (spread resistance parameter). EPL parameters exhibited a decreasing trend with an increase in surface roughness. Estimated activation energies for solder spreading were found to be in between those reported for inert and highly reactive spreading systems. © 2010 American Society of Mechanical Engineers.Item Electrodeposition of Zn-Ni, Zn-Fe and Zn-Ni-Fe alloys(2010) Hegde, A.C.; Venkatakrishna, K.; Eliaz, N.Zn-Fe, Zn-Ni and Zn-Ni-Fe coatings were electrodeposited galvanostatically on mild steel from acidic baths (pH 3.5) consisted of ZnCl2, NiCl2, FeCl2, gelatin, sulfanilic (p-aminobenzenesulfonic) acid and ascorbic acid. Cyclic voltammetry showed that the effect of gelatin was more pronounced than that of sulfanilic acid, and that the deposition of the ternary alloy behaved differently from the deposition of the binary alloys. In all three systems, the Faradaic efficiency was higher than 88%, the rate of Zn deposition was heavily influenced by mass-transport limitation at high applied current densities, and the deposition was of anomalous type. For each applied current density, the concentrations of Ni and Fe in the ternary alloy were higher than the corresponding concentrations in the binary alloys. The hardness of Zn-Ni coatings was the highest, while that of Zn-Fe coatings was the lowest. The Zn-Ni-Fe coatings were the smoothest, had distinguished surface morphology, and contained ZnO in the bulk, not just on the surface. The lowest corrosion rate in each alloy system (214, 325 and 26?m year-1 for Zn-Ni, Zn-Fe and Zn-Ni-Fe, respectively) was characteristic of coatings deposited at 30, 30 and 40mAcm-2, respectively. The higher corrosion resistance of the ternary alloy was also reflected by a higher corrosion potential, a higher impedance and a higher slope of the Mott-Schottky line. The enhanced corrosion behavior of the ternary alloy was thus attributed to its chemical composition, phase content, roughness and the synergistic effect of Ni and Fe on the n-type semiconductor surface film. © 2010 Elsevier B.V.Item Effect of mushy state rolling on age-hardening and tensile behavior of Al-4.5Cu alloy and in situ Al-4.5Cu-5TiB2 composite(Elsevier Ltd, 2011) Siddhalingeshwar, I.G.; Herbert, M.A.; Chakraborty, M.; Mitra, R.The effect of mushy state rolling on aging kinetics of stir-cast Al-4.5Cu alloy and in situ Al-4.5Cu-5TiB2 composite and their tensile behavior in solution-treated (495°C) or differently aged (170°C) conditions, has been investigated. As-cast or pre-hot rolled alloy and composite samples were subjected to single or multiple mushy state roll passes to 5% thickness reduction at temperatures for 20% liquid content. Peak-aging times of mushy state rolled composite matrices have been found as ?7.5-10% of that of as-cast alloy. Such enhancement in aging kinetics is attributed to homogeneity in Cu atom distribution as well as increase in matrix dislocation density due to thermal expansion coefficient mismatch between Al and TiB2, matrix grain refinement and particle redistribution, achieved by mushy state rolling. Uniform precipitate distribution in mushy state rolled composite matrices leads to greater peak-age microhardness with higher yield and ultimate tensile strengths than those in as-cast alloy and composite. © 2010 Elsevier B.V.Item Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperature(Elsevier Ltd, 2012) Prabhu, K.N.; Deshapande, P.; Satyanarayan, S.Solidification rate is an important variable during processing of materials, including soldering, involving solidification. The rate of solidification controls the metallurgical microstructure at the solder joint and hence the mechanical properties. A high tensile strength and a lower ductile-brittle transition temperature are necessary for reliability of solder joints in electronic circuits. Hence in the present work, the effect of cooling rate during solidification on microstructure, impact and tensile properties of Sn-9Zn lead-free solder alloy was investigated. Four different cooling media (copper and stainless steel moulds, air and furnace cooling) were used for solidification to achieve different cooling rates. Solder alloy solidified in copper mould exhibited higher cooling rate as compared to other cooling media. The microstructure is refined as the cooling rate was increased from 0.03 to 25 °C/s. With increase in cooling rate it was observed that the size of Zn flakes became finer and distributed uniformly throughout the matrix. Ductile-to-brittle transition temperature (DBTT) of the solder alloy increased with increase in cooling rate. Fractured surfaces of impact test specimens showed cleavage like appearance and river like pattern at very low temperatures and dimple like appearance at higher temperatures. The tensile strength of the solder alloy solidified in Cu and stainless moulds were higher as compared to air and furnace cooled samples. It is therefore suggested that the cooling rate during solidification of the solder alloy should be optimum to maximize the strength and minimize the DBTT. © 2011 Elsevier B.V.Item Flow visualization and study of critical heat flux enhancement in pool boiling with Al2O3-water nanofluids(Serbian Society of Heat Transfer Engineers, 2012) Hegde, R.N.; Rao, S.S.; Reddy, R.P.Pool boiling heat transfer characteristics of Al2O3 -water nanofluids is studied experimentally using a NiCr test wire of 36 standard wire guage diameter. The experimental work mainly concentrated on (1) change of critical heat flux with different volume concentrations of nanofluid and (2) flow visualization of pool boiling using a fixed concentration of nanofluid at different heat flux values. The experimental work revealed an increase in critical heat flux value of around 48% andflow visualization helped in studying the pool boiling behaviour of nanofluid.Out of the various reasons which could affect the critical heatflux enhancement, surface roughness plays a major role in pool boiling heat transfer.Item Flow visualization, critical heat flux enhancement, and transient characteristics in pool boiling using nanofluids(ASTM International, 2012) Hegde, R.N.; Rao, S.S.; Reddy, R.P.This paper presents the experimental outcome of a study of the pool boiling heat transfer characteristics of alumina and CuO nanofluid in distilled water using a 0.19 mm diameter NiCr wire. A series of experiments were conducted in order to visualize the flow, critical heat flux (CHF) enhancement, and transient characteristics of nanofluid. The boiling phenomenon was visualized using a 0.1 g/l concentration of alumina nanofluid. The average bubble diameter was measured and was found to increase with increased heat flux. The average bubble contact angle decreased from 69° during the initial stages of boiling to 33° at CHF. Massive vapour bubbles were observed on the test heater surface near the CHF, inducing vapour blankets and forming hot/dry spots. The increase in the CHF could be well explained by the hot/dry spot theory. Pool boiling experiments conducted using low volume concentrations of CuO-water nanofluid at atmospheric pressure in distilled water showed an increase in the CHF by 30 % at a 0.3 g/l concentration. The transient behaviour of nanofluid, examined by exposing the heater surface at a constant heat flux of 700 kW/m2, indicated CHF enhancement of 5.21 % to 6.77 % for the two time durations. Based on the experimental investigations, it was concluded that the CHF enhancement is due to nanoparticle coating, which changes the thickness of the surface as a function of time and surface wettability and corroborates the hot/dry spot theory. Copyright © 2012 by ASTM International.Item Magnetic property and corrosion resistance of electrodeposited nanocrystalline iron-nickel alloys(Elsevier B.V., 2012) Pavithra, G.P.; Hegde, A.In the present investigation we have galvanostatically synthesized nanocrystalline Fe-Ni alloys on copper substrate. The effect of current density (c.d.) on composition, surface morphology and phase structure were studied for explaining the magnetic and electrochemical properties of the nanocrystalline alloy. The bath found to exhibit the preferential deposition of less noble Fe than Ni, and at no conditions of c.d., the deposition has changed from anomalous to normal type. Surface morphology and structural characteristics of the deposits were examined using scanning electron microscopy (SEM) and X-ray diffraction (XRD) analysis. As composition of the alloy varied, consequent to the current density a change of body centered cubic structure (bcc) to face centered cubic structure (fcc) was observed for nanocrystalline materials. Finally, the conditions responsible for peak magnetic property and corrosion resistance were optimized. Factors responsible for improved functional properties were explained in terms of surface morphology and crystalline grain size of the coatings. © 2012 Elsevier B.V.Item Comparison of spreading behaviour and interfacial microstructure in Sn-0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrate(Maney Publishing michael.wagreich@univie.ac.at, 2013) Satyanarayan, S.; Prabhu, K.In the present work, spreading behaviour and development of interfacial microstructure in Sn- 0·7Cu, Sn-0·3Ag-0·7Cu and Sn-2·5Ag-0·5Cu lead free solder alloys on Fe-42Ni substrates having two different surface textures were investigated. Smooth textured surfaces yielded better wettability than rough surfaces particularly for Sn-0·7Cu solder alloy. Wettability of Sn-0·7Cu solder on rough textured surfaces was found to be poor compared to other solder alloys. Spreading of Sn-0·7Cu solder on substrate surface showed longer viscous regime, Sn-2·5Ag- 0·5Cu solder exhibited shortest viscous regime. Sn-0·3Ag-0·7 solder showed intermediate behaviour. Sn-Cu solder alloy exhibited needle and coarse shaped (Cu,Ni)6Sn5 intermetallics at the interface and in the matrix of the solder alloy on smooth substrate, whereas on rough substrate, formation of only coarse shaped (Cu,Ni)6Sn5 intermetallic compounds (IMCs) was observed. For Sn-0·3Ag-0·7Cu solder alloy, Fe-Ni-Sn and FeSn2 IMCs identified at the interface. (Cu,Ni)6/Sn5 IMCs were found to be less coarser than as observed at Sn-0·7Cu/substrate interface. Sn-2·5Ag-0·5Cu alloy exhibited (Cu,Ni) 3Sn4 and (Cu,Ni)6 Sn5 IMCs at the interface and in the bulk of solder alloy. © 2013 Institute of Materials, Minerals and Mining.Item Effect of purging gas on wetting behavior of Sn-3.5Ag lead-free solder on nickel-coated aluminum substrate(Springer Science and Business Media, LLC, 2013) Prabhu, K.; Varun, M.; Satyanarayan, S.The wetting characteristics of Sn-3.5Ag lead-free solder alloy on nickel-coated aluminum substrates in air (ambient), nitrogen, and argon atmospheres were investigated. The contact angles for the solder alloy obtained under air and argon atmospheres were in the range of 36 -38. With nitrogen atmosphere the contact angle was found to be significantly lower at about 26. Solder solidifying in air exhibited needle-shaped tin-rich dendrites surrounded by a eutectic matrix. The amount of tin dendrites decreased in argon atmosphere. However, the morphology of tin dendrites transformed from needle-shaped to nearly non-dendritic shape as the soldering atmosphere was changed from air to nitrogen. The interfacial microstructures revealed the presence of Ni 3Sn and Ni3Sn4 IMCs at the interface. The enhanced wettability observed under nitrogen atmosphere is attributed to the higher thermal conductivity of nitrogen gas and the formation of higher amount of Ni3Sn IMCs at the interface compared to air and argon atmospheres. © 2012 ASM International.