Faculty Publications

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Author: search.filters.author.Prabhu, K.N.Subject: search.filters.subject.Intermetallics

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    Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures
    (ASTM International, 2011) Satyanarayan, S.; Prabhu, K.N.
    The effect of surface roughness on wetting behaviour and evolution of microstructure of two lead-free solders (Sn-2.625Ag-2.25Zn and Sn-1.75Ag-4.5Zn) on copper substrate was investigated. Both solders exhibited good wettability on copper substrates having rough surface and lower wettabilty on smooth surfaces. The contact angles of solders decreased linearly with increase in surface roughness of the substrate. The exponential power law, ?=exp(-KT -1), was used to model the relaxation behaviour of solders. A high intermetallic growth was observed at the interface particularly on copper substrates with rough surface texture. A thin continuous interface showing scallop intermetallic compounds (IMC) was obtained on smooth surfaces. With an increase in surface roughness, the IMC morphology changed from scallop shaped to needle type at the Sn-2.625Ag-2.25Zn solder/ substrate interface and nodular to plate like IMCs for Sn-1.75Ag-4.5Zn solder matrix. Copyright © 2010 by ASTM International.
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    Wetting behaviour and interfacial microstructure of Sn-Ag-Zn solder alloys on nickel coated aluminium substrates
    (2011) Satyanarayan, S.; Prabhu, K.N.
    Wetting behaviours of two lead free solders (Sn-2·625Ag- 2·25Zn and Sn-1·75Ag-4·5Zn) on nickel coated aluminium substrates were investigated. Sn-2·625Ag-2·25Zn exhibited better wettability compared to Sn-1·75Ag-4·5Zn solder. Contact angles of the solders increased with increasing roughness of the substrate. The Young-Dupre equation was used to evaluate the work of adhesion of solder on the substrate. Sn-2·625Ag-2·25Zn solder exhibited higher work of adhesion than Sn-1·75Ag-4·5Zn. A thin continuous layer of Ni 3Sn was detected at the interface between Sn-2·625Ag- 2·25Zn solder and nickel coated Al substrate. Sn-1·75Ag- 4·5Zn solder exhibited scallop intermetallic compounds (IMCs) growing into the solder field as well as a thin continuous IMC in some cases. Ni 3Sn and Ni3Sn4 IMCs were observed at the interface of Sn-1·75Ag-4·5Zn solder and nickel coated Al. © 2011 Institute of Materials, Minerals and Mining.
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    Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn-0.7Cu solder alloy and copper substrate
    (2012) Satyanarayan, S.; Prabhu, K.N.
    In the present work, the effect of soldering temperature (270 and 298 °C) and substrate surface texture (0.02 and 1.12 ?m) on wetting characteristics and morphology of intermetallic compounds (IMCs) between Sn-0.7Cu lead-free solder on copper substrates was investigated. It was found that increase in temperature and substrate surface roughness improved the wettability of solder alloy. However, the effect of surface roughness on wettability was significant as compared to that of temperature. The spreading of solder alloy was uniform on smooth substrate, whereas spreading of the alloy on rough substrate resulted in an oval shape. The morphology of IMCs transformed from long needle shaped to short and thick protrusions of IMCs with increase in surface roughness of the substrate. Needle shaped and thick protruded intermetallics formed at the solder/Cu interface were identified as Cu 6Sn 5 compounds. The formation of Cu 3Sn IMC was observed only for the spreading of solder alloy at 298 °C which contributed to improvement in the wettability of solder alloy on both smooth and rough substrate surfaces. © Springer Science+Business Media, LLC 2012.
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    Effect of Mn on cooling behaviour and microstructure of chill cast Zn-Al (ZA8) alloy
    (2012) Ramesh, G.; Vishwanatha, H.M.; Prabhu, K.N.
    In the present work, the effect of manganese addition to ZA8 alloy on thermal analysis parameters, heat transfer and microstructure was investigated. The thermal analysis parameters were found to be significantly affected by chemical modification of ZA8 alloy. Cooling curve and differential scanning calorimetry analyses of modified alloy showed nucleation of new phase other than b dendrites. Chilling of modified alloy resulted in decreased liquidus temperature and enhanced eutectoid transformation. Further, chilling avoids the formation of intermetallic compounds in modified alloy. The heat flux transients were estimated using inverse modelling during solidification of unmodified and modified alloys against different chills. The peak heat flux decreased on addition of Mn to ZA8 alloy. Differential scanning calorimetry analysis indicated that the addition of Mn to ZA8 alloy decreases the heat of solidification. The addition of Mn to ZA8 alloy increased the contact angle, indicating decreased wettability of the modified alloy on the chill surface. The microstructure of ZA8 with Mn showed an increased amount of b phase and a decreased amount of eutectic. X-ray diffraction analysis confirmed the formation of MnAl6 intermetallics in Mn added ZA8 alloy. Chilling with chemical modification resulted in enhanced decomposition of b phase. © 2012 Institute of Materials, Minerals and Mining.
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    Characterisation of Sn–3.5Ag solder/Cu joint under various reflow conditions
    (Taylor and Francis Ltd., 2022) Georgy, K.; Tikale, S.; Prabhu, K.N.
    The effect of reflow time and reflow temperatures on wettability and bond shear strength of Sn–3.5Ag solder alloy on a Cu substrate is assessed for reflow times of 10 s, 100 s, 300 s, 500 s and reflow temperatures of 250 °C, 270 °C, 290 °C, 320 °C. The wetting regime was found to have capillary, gravity, and viscous regimes. A microstructural study using a scanning electron microscope (SEM) with energydispersive spectroscopy revealed the presence of intermetallic compounds at the interface between the substrate and solder droplet. The bond strength of the solder joint is maximum at a reflow temperature of 250 °C and a reflow time of 10 s. Bond shear strength decreased with an increase in reflow time from 10 s to 500 s. The effect of different cooling conditions on the solder–substrate joint is also investigated. © 2022 Institute of Materials, Minerals and Mining.