Conference Papers

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    Lattice Heating Effects on Electric Field and Potential for a Silicon on Insulator (SOI) MOSFET for MIMO Applications
    (Institute of Electrical and Electronics Engineers Inc., 2023) Kumar, P.K.; Srikanth, K.; Boddukuri, N.K.; Suresh, N.; Vani, B.V.
    Finding substitutes for Silicon dioxide materials is necessary when technology is scaled back. TheSOI device conceals the self heating effects induced in the MOSFET. There exists an active path of conduction from the drain to substrate and source to substrate in the entire device to curb the heating effects. The buried oxide layer used in the device is SiO2 and it is essentially free from the issues related to fabrication and performance. The comparison is made from the bulk MOSFET and SOI MOSFET from the literature. The Silicon (Si) and Silicon Germanium (SiGe) materials are considered for the analysis. The lattice temperature effects are induced for the comparative analysis of the proposed SOI MOSFET. The main parameters of interest in the study are the electric field (lateral and vertical) and potential across the channel. © 2023 IEEE.
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    Development of Pneumatic Soft Gripper for Effective Material Handling
    (Institute of Electrical and Electronics Engineers Inc., 2024) Naveen, S.; Panigrahi, S.; Vinit, A.; Sudar, I.H.; Thomas, M.J.
    Recent times have shown a drastic transition in robotics from rigid to soft mechanisms. The reason is that soft robots offer safer human-robot interactions, reduce weight and also offer strong environmental adaptability. However, the inherent characteristics of soft materials to exhibit multiple degrees of freedom (DoF) make it challenging to control their movements. Therefore, this paper presents the development of a soft gripper with simple architecture to effectively and economically manipulate delicate objects. The gripper constructed using silicon rubber has an air cavity to actuate its opening and closing pneumatically. This paper presents the different stages of its construction and demonstrates its application on a 4 DoF robotic arm for handling delicate objects. A simulation study of the structural parameters of the proposed soft gripper is also carried out using ANSYS finite element software. The preliminary results show the superior adaptability of the soft gripper in handling objects of various shapes and sizes. The proposed system can find application in food, biomedical and electronic industries. © 2024 IEEE.