Conference Papers

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    Wetting kinetics and joint strength of Sn-0.3Ag-0.7Cu lead-free solder alloy on copper substrate as a function of reflow time
    (Trans Tech Publications Ltd ttp@transtec.ch, 2015) Sona, M.; Prabhu, K.
    Solder plays a vital role in the interconnection of electronic devices in electronic assemblies. As an interconnection material, the solder joint executes electrical, mechanical and thermal functions. The use of lead bearing solders in electronic products is banned due to the toxicity and environmental risks coupled with lead. In the present study, wetting kinetics, interfacial reactions and the formation of intermetallic compounds (IMCs) during solidification of Sn-0.3Ag- 0.7Cu solder alloy on Cu substrate and the corresponding joint strength were studied as a function of reflow time. Experiments were carried out at various reflow times of 10, 100, 300 and 500s. The reflow temperature was maintained at 270°C. The solder alloy showed enhanced wettability on the substrate at longer reflow times. The thickness of IMC layer formed during a reflow time of 10s was 1.67μm and the thickness increased to 2.20μm, 2.85μm, 2.91μm during 100s, 300s and 500s of reflow time respectively. The joint shear test was performed to assess the integrity of Sn-0.3Ag- 0.7Cu solder solidified on Cu substrates using Nordson DAGE 4000 Plus bond tester. The joint strength increased with the increase in reflow time up to 300s and the maximum joint strength was observed for samples reflowed for 300s. Although the samples reflowed for 500s samples showed good wettability, they exhibited lowest joint strength. © (2015) Trans Tech Publications, Switzerland.
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    Experimental investigation of joint properties of friction stir welded aluminium matrix composite
    (Elsevier Ltd, 2021) Prabhu B, S.R.; Shettigar, A.; Herbert, M.A.; Rao, S.S.
    The present study is focused on welding of particulate aluminium matrix composites using friction stir welding process and investigating the influence of various process variables on the joint properties. The microstructural study and mechanical behaviors such as tensile strength and hardness of the weld zone were measured. Microstructural studies showed that process variables play pivotal role in refinement of grains. Compared to the top of the weld region, smaller grains were formed at the bottom due to variation in the heating effect. Measurement of the tensile strength and hardness of the weld zone, indicated that process variables plays important role in controlling the joint properties. Beyond the optimum range of process variables, the joint strength of welded part deteriorates due to the insufficient stirring and lack of plasticization leads to defect formation. Joint welded with traverse speed of 100 mm/min and revolution speed of 1200 rpm exhibited better mechanical properties. © 2021 Elsevier Ltd. All rights reserved.