Conference Papers
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Item Wetting characteristics of sn-0.7cu lead-free solder alloy on copper substrates(Trans Tech Publications Ltd ttp@transtec.ch, 2012) Satyanarayan, S.; Prabhu, K.N.In the present work, the effect of surface texture on wetting characteristics of lead-free solder Sn-0.7Cu on copper substrates have been investigated at 298°C. The wetting tests were carried out using FTA 200 (First Ten Angstrom) dynamic contact angle analyzer. The surface texture of copper substrate significantly affected the wetting properties of Sn-0.7Cu solder alloy. Contact angles of about 30° were obtained on Cu substrate having smooth surface texture (Ra = 0.0155μm). On other hand contact angles on rough copper surface texture (Ra = 1.1194μm) were reduced to 20°. The contact angles decreased with increasing surface texture of Cu substrate. For rough Cu substrate, it seems that the solder atoms dissolve into the substrate in the time period of 200-600s. © (2012) Trans Tech Publications.Item Wetting behavior of lead-free solders on copper substrates(Institution of Engineering and Technology jbristow@theiet.org, 2013) Satyanarayan, S.; Prabhu, K.N.The effect of substrate surface roughness on the wetting behavior of Sn-0.7Cu and Sn-0.3Ag-0.7Cu solder alloys on copper (Cu) substrates was investigated. The contact angles of both solder alloys decreased with increase in substrate surface roughness. The exponential power law (EPL), φ = exp (-Kτn), was used to model the relaxation behaviour of solders. Solder spreading kinetics was successfully represented by the (EPL). EPL parameters (K and n) alloy decreased with an increase in surface roughness. Spreading of solder alloys on both substrates exhibited capillary, gravity and viscous regimes. High spreading rates in the capillary regime, moderate in gravity regime and almost constant rates in viscous regimes were observed.Item Lead-free solders for high-temperature applications(Association of American Publishers, 2025) Satyanarayan, S.; Narayan Prabhu, K.Due to the toxicity of Pb, efforts to develop alternatives to Pb-based solders have been increased significantly. However, only a limited number of lead (Pb)-free solder systems exist for high-temperature applications. In the present paper, a review of the selection of Pb-free solder alloys for high-temperature (300°C–400°C) applications to replace traditional Pb-based alloys is carried out. A discussion on the research and development of high-temperature solder alloys is highlighted in the current review. The solder systems with alloying additions like Au, Sb, Ni and Zn must be investigated to be used as potential candidate materials for high-temperature applications © 2025 by authors.