Conference Papers
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Item Wetting characteristics of sn-0.7cu lead-free solder alloy on copper substrates(Trans Tech Publications Ltd ttp@transtec.ch, 2012) Satyanarayan, S.; Prabhu, K.N.In the present work, the effect of surface texture on wetting characteristics of lead-free solder Sn-0.7Cu on copper substrates have been investigated at 298°C. The wetting tests were carried out using FTA 200 (First Ten Angstrom) dynamic contact angle analyzer. The surface texture of copper substrate significantly affected the wetting properties of Sn-0.7Cu solder alloy. Contact angles of about 30° were obtained on Cu substrate having smooth surface texture (Ra = 0.0155μm). On other hand contact angles on rough copper surface texture (Ra = 1.1194μm) were reduced to 20°. The contact angles decreased with increasing surface texture of Cu substrate. For rough Cu substrate, it seems that the solder atoms dissolve into the substrate in the time period of 200-600s. © (2012) Trans Tech Publications.Item Development of clay based nanofluids for quenching(2012) Ramesh, G.; Prabhu, K.N.In the present work the effect of addition of nanoclay particles having concentrations of 0.001, 0.01 and 0.1 vol% on cooling performance of water during immersion quenching was investigated. Cooling curve analyses were carried out by using standard ISO/DIS 9950 quench probe. Wetting behavior of nanoquenchant was studied using dynamic contact angle analyzer. The spreading behavior of droplets of quench media on INCONEL 600 substrate indicates improved wetting behavior of nanofluids. The peak cooling rate and cooling rate at 700°C for water decreased by addition of nanoparticles. Further, quenching in nanofluid shows longer vapour blanket stage as compared to water. The estimated flux transients and Grossmann H factor clearly show that decreased cooling performance of water by addition of nanoparticles. Copyright © 2012 ASM International® All rights reserved.Item Wetting behavior of lead-free solders on copper substrates(Institution of Engineering and Technology jbristow@theiet.org, 2013) Satyanarayan, S.; Prabhu, K.N.The effect of substrate surface roughness on the wetting behavior of Sn-0.7Cu and Sn-0.3Ag-0.7Cu solder alloys on copper (Cu) substrates was investigated. The contact angles of both solder alloys decreased with increase in substrate surface roughness. The exponential power law (EPL), φ = exp (-Kτn), was used to model the relaxation behaviour of solders. Solder spreading kinetics was successfully represented by the (EPL). EPL parameters (K and n) alloy decreased with an increase in surface roughness. Spreading of solder alloys on both substrates exhibited capillary, gravity and viscous regimes. High spreading rates in the capillary regime, moderate in gravity regime and almost constant rates in viscous regimes were observed.