Conference Papers
Permanent URI for this collectionhttps://idr.nitk.ac.in/handle/123456789/28506
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Item Microstructure evolution in AI-7Si-0.3Mg alloy during partial melting and solidification from melt: A comparison(2006) Nyamannavar, S.; Ravi, M.; Prabhu, K.N.In the present work, a comparative study of microstructure evolution in Sr modified AI-7Si-0.3Mg alloy isothermally held at semi-solid state under conditions of (i) cooling from liquid state and (ii) partial melting from solid state to the semi-solid temperature was carried out. The effect of cooling rate (0.01 to 100 K/s) on the microstructure during solidification of semisolid alloy is studied. Partial melting of alloy results in the fine and more spherical solid phase compared to cooling of the same alloy from liquid state. Chemical modification of the eutectic silicon by Sr addition was found to remain same for both cooling the melt from liquid as well as partial melting from solid state, contrary to the reported results. The morphology of eutectic silicon corresponding to the liquid entrapped in solid phase is finer compared to that in interconnected liquid channel.Item Constitutional undercooling and growth of globuletic particle(2008) Nyamannavar, S.; Ravi, M.; Prabhu, K.N.Isothermal holding of an alloy at semi-solid temperature and quenching/cooling, results in formation of instabilities on the globuletic α-particles. The aspect of instability formation is necessary input for accurate simulation and modeling of microstructure evolution for semi-solid metal forming (SSM) process. In the present work instability formation is studied for Al-7Si-0.3Mg alloy. Small cylindrical samples (10 mm, height 10 mm) were subjected to isothermal holding at semisolid temperature followed by quenching/cooling to room temperature. Instabilities were found to form at cooling rates 30 and 100 K/s. Instability formation is explained by interface stabilization theory based on the constitutional undercooling of liquid ahead of the solid/liquid interface.Item Experimental models for assessment of interfacial heat transfer in dip soldering(2010) Nyamannavar, S.; Prabhu, K.N.The success of a numerical simulation for solder solidification during soldering processes depends on an accurate knowledge of heat transfer phenomenon at the solder/substrate interface. Two experimental setups were designed to study the interfacial heat transfer at solder/substrate interface. In the first method, a cylindrical probe of substrate material was dipped in liquid solder and solder was allowed to solidify around the metal probe. In the second method the test probe was dipped in the bulk solder liquid of sufficiently large quantity and allowed to attain the surrounding solder liquid temperature. Temperature at the center of the probe was measured using thermocouple. Heat flux transients at the surface of the probe were estimated by lumped heat capacitance method. SEM study at the solder/substrate interfacial region for experiments of solidifying solder around the test probe revealed the existence of a clear gap with aluminum substrate. A conforming contact was obtained with copper substrate. The nature of heat flux transients was found to be different in two experiments. © (2010) Trans Tech Publications.