Conference Papers

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Author: search.filters.author.Augustin, A.Has files: No

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    Electron microscopic study of nodules formed during electrodeposition of copper on aluminium
    (Trans Tech Publications Ltd ttp@transtec.ch, 2015) Augustin, A.; Bhat, K.; Udupa, K.R.; Hegde, A.C.
    Copper thin film was deposited on double zincated aluminium using electrodeposition route. To understand the growth behavior of copper nodules, deposition was done by varying coating current density. The topography and cross section of the coating was analyzed by using SEM. The structural details of copper nodules were studied by using TEM. Deposited copper thin film was made up of pomegranate like nodules with size varying from 5 μm to 8 μm, varying as a function of coating current density. At higher current density, the coating was made up of multiple layers of nodules having defects like twins, dislocations and stacking faults. The nodules had fine crystallites of size in the range of 50 nm. © (2015) Trans Tech Publications, Switzerland.
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    Crystallite size measurement and micro-strain analysis of electrodeposited copper thin film using Williamson-Hall method
    (American Institute of Physics Inc. subs@aip.org, 2016) Augustin, A.; Rajendra Udupa, K.; Bhat, K.U.
    The improvement in hydrophilicity of copper coating on aluminium for better antimicrobial activity can be achieved by increase in surface energy. The surface energy depends on the micro-strain of the coating. Micro-strain in the coatingincreases with reduction in crystallite size. In this investigation, the crystallite size in the electrodeposited copper coating was varied by varying deposition current density. Crystallite size and micro-strain in the coating were estimated using Williamson-Hall method. Values of crystallite sizes using TEM micrographs were in agreement with that using Williamson-Hall method. Also, presence of nano-Twins in the coating contributed for micro-strain in copper coating. © 2016 Author(s).