Journal Articles
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Item Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures(2010) Satyanarayan, S.; Prabhu, K.N.The effect of surface roughness on wetting behaviour and evolution of microstructure of two lead-free solders (Sn-2.625Ag-2.25Zn and Sn-1.75Ag-4.5Zn) on copper substrate was investigated. Both solders exhibited good wettability on copper substrates having rough surface and lower wettabilty on smooth surfaces. The contact angles of solders decreased linearly with increase in surface roughness of the substrate. The exponential power law, ?=exp(-K ?n), was used to model the relaxation behaviour of solders. A high intermetallic growth was observed at the interface particularly on copper substrates with rough surface texture. A thin continuous interface showing scallop intermetallic compounds (IMC) was obtained on smooth surfaces. With an increase in surface roughness, the IMC morphology changed from scallop shaped to needle type at the Sn-2.625Ag-2.25Zn solder/substrate interface and nodular to plate like IMCs for Sn-1.75Ag-4.5Zn solder matrix. Copyright © 2010 by ASTM International.Item Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures(ASTM International, 2011) Satyanarayan, S.; Prabhu, K.N.The effect of surface roughness on wetting behaviour and evolution of microstructure of two lead-free solders (Sn-2.625Ag-2.25Zn and Sn-1.75Ag-4.5Zn) on copper substrate was investigated. Both solders exhibited good wettability on copper substrates having rough surface and lower wettabilty on smooth surfaces. The contact angles of solders decreased linearly with increase in surface roughness of the substrate. The exponential power law, ?=exp(-KT -1), was used to model the relaxation behaviour of solders. A high intermetallic growth was observed at the interface particularly on copper substrates with rough surface texture. A thin continuous interface showing scallop intermetallic compounds (IMC) was obtained on smooth surfaces. With an increase in surface roughness, the IMC morphology changed from scallop shaped to needle type at the Sn-2.625Ag-2.25Zn solder/ substrate interface and nodular to plate like IMCs for Sn-1.75Ag-4.5Zn solder matrix. Copyright © 2010 by ASTM International.Item Wetting behaviour and interfacial microstructure of Sn-Ag-Zn solder alloys on nickel coated aluminium substrates(2011) Satyanarayan, S.; Prabhu, K.N.Wetting behaviours of two lead free solders (Sn-2·625Ag- 2·25Zn and Sn-1·75Ag-4·5Zn) on nickel coated aluminium substrates were investigated. Sn-2·625Ag-2·25Zn exhibited better wettability compared to Sn-1·75Ag-4·5Zn solder. Contact angles of the solders increased with increasing roughness of the substrate. The Young-Dupre equation was used to evaluate the work of adhesion of solder on the substrate. Sn-2·625Ag-2·25Zn solder exhibited higher work of adhesion than Sn-1·75Ag-4·5Zn. A thin continuous layer of Ni 3Sn was detected at the interface between Sn-2·625Ag- 2·25Zn solder and nickel coated Al substrate. Sn-1·75Ag- 4·5Zn solder exhibited scallop intermetallic compounds (IMCs) growing into the solder field as well as a thin continuous IMC in some cases. Ni 3Sn and Ni3Sn4 IMCs were observed at the interface of Sn-1·75Ag-4·5Zn solder and nickel coated Al. © 2011 Institute of Materials, Minerals and Mining.