Journal Articles
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Item Wetting behaviour and interfacial microstructure of Sn-Ag-Zn solder alloys on nickel coated aluminium substrates(2011) Satyanarayan, S.; Prabhu, K.N.Wetting behaviours of two lead free solders (Sn-2·625Ag- 2·25Zn and Sn-1·75Ag-4·5Zn) on nickel coated aluminium substrates were investigated. Sn-2·625Ag-2·25Zn exhibited better wettability compared to Sn-1·75Ag-4·5Zn solder. Contact angles of the solders increased with increasing roughness of the substrate. The Young-Dupre equation was used to evaluate the work of adhesion of solder on the substrate. Sn-2·625Ag-2·25Zn solder exhibited higher work of adhesion than Sn-1·75Ag-4·5Zn. A thin continuous layer of Ni 3Sn was detected at the interface between Sn-2·625Ag- 2·25Zn solder and nickel coated Al substrate. Sn-1·75Ag- 4·5Zn solder exhibited scallop intermetallic compounds (IMCs) growing into the solder field as well as a thin continuous IMC in some cases. Ni 3Sn and Ni3Sn4 IMCs were observed at the interface of Sn-1·75Ag-4·5Zn solder and nickel coated Al. © 2011 Institute of Materials, Minerals and Mining.Item Heat transfer at the casting/chill interface during solidification of commercially pure Zn and Zn base alloy (ZA8)(2012) Ramesh, G.; Prabhu, K.N.Casting/chill interfacial heat transfer during solidification of commercially pure zinc and ZA8 alloy against copper, hot die steel, stainless steel and aluminiuminstrumented chills was investigated. The peak heat flux strongly depends on the thermophysical properties of chill, chill surface condition and superheat of the castingmaterial. Contact angles of alumina coatingmeasured on various substrates suggested that the adhesion of the coating material on copper chill was significantly better as compared to other chill materials. The heat flux curve in the case of coated chills is characterised by a double peak indicating remelting of the solidified casting shell. The second peak in the HTC curve is lower for high conductivity and higher for low conductivity chills as compared to the first peak. It is possible that solid shell formation and remelting occurred in the case of high thermal conductivity chills, whereas shell remelting did not happen in lower thermal conductivity chills. © 2012 W. S. Maney & Son Ltd.