Browsing by Author "Singhal, R."
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Item Effect of Residual Resist on Performance of Single-Mode 1 4 Optical Splitter in Photosensitive Polymer(2010) Singhal, R.; Satyanarayan, M.N.; Pal, S.Polymer residues are generally left in the Y-junctions of the conventional splitters. Besides increased insertion loss, the Y-junction residue results in asymmetric distribution of power at device outputs. An analysis of the device performance in the presence of junction residue is presented and a design to overcome the non-uniformities in output power distribution brought about by the presence of the residue is proposed. Taylor & Francis Group, LLC.Item Effect of Residual Resist on Performance of Single-Mode 1× 4 Optical Splitter in Photosensitive Polymer(2010) Singhal, R.; Satyanarayan, M.N.; Pal, S.Polymer residues are generally left in the Y-junctions of the conventional splitters. Besides increased insertion loss, the Y-junction residue results in asymmetric distribution of power at device outputs. An analysis of the device performance in the presence of junction residue is presented and a design to overcome the non-uniformities in output power distribution brought about by the presence of the residue is proposed. © Taylor & Francis Group, LLC.Item Fabrication of monomode channel waveguides in photosensitive polymer on optical adhesive(2011) Singhal, R.; Satyanarayan, M.N.; Pal, S.We present fabrication of optical waveguides in a photosensitive polymer. The process to fabricate monomode polymeric channel waveguides using simple direct ultraviolet (UV) photolithography is optimized. Channel waveguides of width ?2 to 2.4 ?m and height ?1.8 to 2.2 ?m are obtained on development after a crosslinkable negative tone epoxy SU-8 2002 polymer is exposed to UV through a photomask. Norland Optical Adhesive 61 (NOA 61) was used as under- and overclad. The average insertion loss obtained at chip-level is ?11 dB (TE00) and ?12 dB (TM00) for 2-cm waveguide at 1550 nm. 2011 Society of Photo-Optical Instrumentation Engineers (SPIE).Item Fabrication of monomode channel waveguides in photosensitive polymer on optical adhesive(2011) Singhal, R.; Satyanarayan, M.N.; Pal, S.We present fabrication of optical waveguides in a photosensitive polymer. The process to fabricate monomode polymeric channel waveguides using simple direct ultraviolet (UV) photolithography is optimized. Channel waveguides of width ?2 to 2.4 ?m and height ?1.8 to 2.2 ?m are obtained on development after a crosslinkable negative tone epoxy SU-8 2002 polymer is exposed to UV through a photomask. Norland Optical Adhesive 61 (NOA 61) was used as under- and overclad. The average insertion loss obtained at chip-level is ?11 dB (TE00) and ?12 dB (TM00) for 2-cm waveguide at 1550 nm. © 2011 Society of Photo-Optical Instrumentation Engineers (SPIE).Item Fabrication of single-mode Y-branch waveguides in photosensitive polymer with reduced Y-junction residue(2012) Singhal, R.; Satyanarayan, M.N.; Pal, S.Single-mode small-core (?2 ?m 2 ?m) Y-branch waveguide structures in photosensitive polymer have been fabricated. Y-branch waveguides are designed by the beam propagation method and Y-branch waveguides are obtained on development after a cross-linkable negative tone epoxy SU-8 2002 polymer is exposed to UV through a photomask. Optical Adhesive NOA 61 is used as under- and over-clad. The fabrication process is optimized to avoid polymer residue at the Y-junction. The average insertion loss obtained for a 7.2 mm 1 2 device at chip-level is ?13 dB at 1550 nm. 2011 Elsevier GmbH.Item Fabrication of single-mode Y-branch waveguides in photosensitive polymer with reduced Y-junction residue(2012) Singhal, R.; Satyanarayan, M.N.; Pal, S.Single-mode small-core (?2 ?m × 2 ?m) Y-branch waveguide structures in photosensitive polymer have been fabricated. Y-branch waveguides are designed by the beam propagation method and Y-branch waveguides are obtained on development after a cross-linkable negative tone epoxy SU-8 2002 polymer is exposed to UV through a photomask. Optical Adhesive NOA 61 is used as under- and over-clad. The fabrication process is optimized to avoid polymer residue at the Y-junction. The average insertion loss obtained for a 7.2 mm 1 × 2 device at chip-level is ?13 dB at 1550 nm. © 2011 Elsevier GmbH.