Sona, M.Tikale, S.Prabhu, N.2026-02-052019Transactions of the Indian Institute of Metals, 2019, 72, 6, pp. 1579-15839722815https://doi.org/10.1007/s12666-019-01568-5https://idr.nitk.ac.in/handle/123456789/24516In the present study, wettability, interfacial intermetallic growth and shear strength of Sn–Cu eutectic solder solidified on bare as well as nickel-coated copper substrates were examined. Sn–0.7Cu solder was reflowed over the substrate for reflow times ranging from 10 to 500 s at 270 °C. Samples were cooled by quenching in water. The wetting behavior was similar on both the substrates. The corresponding time period to the end of gravity zone (T<inf>gz</inf>) was measured from the relaxation curve obtained from wetting studies. T<inf>gz</inf> was found to be 25 s for Sn–0.7Cu on bare and 50 s on Ni-coated copper substrates. The intermetallic compound layer thickness was fitted to a growth model to study the growth kinetics. The integrity of solder/substrate joint was assessed by performing ball as well as single-lap joint shear tests. The shear strength was found to be maximum at T<inf>gz</inf> for all solder/substrate systems. © 2019, The Indian Institute of Metals - IIM.Contact angleGravity zoneIntermetallic compoundJoint strengthWettability