Narendran, G.Gnanasekaran, N.Arumuga Perumal, D.A.2026-02-052020Heat Transfer Engineering, 2020, 41, 14, pp. 1252-12741457632https://doi.org/10.1080/01457632.2019.1637136https://idr.nitk.ac.in/handle/123456789/23783Thermal design consideration is highly essential for efficient heat dissipation in advanced microprocessors which are subjected to conjugate heat transfer under high heat flux with a minimal area for cooling. Generally, these multicore processors develop a localized high density heat flux referred to as hotspot. The effective use of microchannel in order to mitigate the hotspot is found in literature; however, the flow induced hotspot still exist due to maldistribution of flow inside the microchannel. Henceforth, the present study provides an experimental insight on laminar forced convection in a parallel microchannel heat sink accompanied with 1.2 mm thin copper heat spreader with a surface area of 30 mm2 to effectively migrate the maldistribution flow induced hot spot. The present experimental study provides a profound insight about the hotspot and migration of hotspot to safe zones; as a result, not only the performance of the multi core microprocessor is highly improved but also the reliability of neighboring components is well secured. © 2019, © 2019 Taylor & Francis Group, LLC.GrapheneHeat sinksHeat transferHeating equipmentMicrochannelsSpreadersThermal management (electronics)Conjugate heat transferCopper heat spreaderExperimental investigationsHeat spreadersLaminar forced convectionsMulti-core processorParallel microchannelsThermal designsHeat flux