Prabhu, K.N.Kumar, G.2026-02-052010Journal of Electronic Packaging, 2010, 132, 4, pp. -10437398https://doi.org/10.1115/1.4002899https://idr.nitk.ac.in/handle/123456789/27528The effects of substrate material, substrate surface roughness, and operating temperature on the wetting behavior of Sn-37Pb, Sn-3.5Ag, and Sn-9Zn eutectic solders on metallic substrates were investigated. Solder spreading kinetics was successfully represented by the exponential power law (EPL): ?=exp (-K ?n). The EPL parameter K has the significance of accelerating the kinetics of relaxation while the parameter n represents the resistance to spreading process (spread resistance parameter). EPL parameters exhibited a decreasing trend with an increase in surface roughness. Estimated activation energies for solder spreading were found to be in between those reported for inert and highly reactive spreading systems. © 2010 American Society of Mechanical Engineers.Activation energyBinary alloysLead alloysLead-free soldersMetal substratesSurface roughnessTin alloysZinc alloysExponentialsMaterial substratesMetallic substrateOperating temperaturePower-law parametersSn-37PbSolder spreadingSubstrate materialSubstrate surfaceWetting behaviorWetting