Satyanarayan, S.Prabhu, K.N.2026-02-052011Materials Science and Technology (United Kingdom), 2011, 27, 7, pp. 1157-11622670836https://doi.org/10.1179/026708310X12815992418337https://idr.nitk.ac.in/handle/123456789/27222Wetting behaviours of two lead free solders (Sn-2·625Ag- 2·25Zn and Sn-1·75Ag-4·5Zn) on nickel coated aluminium substrates were investigated. Sn-2·625Ag-2·25Zn exhibited better wettability compared to Sn-1·75Ag-4·5Zn solder. Contact angles of the solders increased with increasing roughness of the substrate. The Young-Dupre equation was used to evaluate the work of adhesion of solder on the substrate. Sn-2·625Ag-2·25Zn solder exhibited higher work of adhesion than Sn-1·75Ag-4·5Zn. A thin continuous layer of Ni <inf>3</inf>Sn was detected at the interface between Sn-2·625Ag- 2·25Zn solder and nickel coated Al substrate. Sn-1·75Ag- 4·5Zn solder exhibited scallop intermetallic compounds (IMCs) growing into the solder field as well as a thin continuous IMC in some cases. Ni <inf>3</inf>Sn and Ni<inf>3</inf>Sn<inf>4</inf> IMCs were observed at the interface of Sn-1·75Ag-4·5Zn solder and nickel coated Al. © 2011 Institute of Materials, Minerals and Mining.Al substrateContinuous layersIMCsInterfacial microstructureLead free soldersNickel coatedSn-Ag-ZnSolder alloysWetting behaviourWork of adhesionAdhesionAluminumContact angleIntermetallicsNickelNickel coatingsSilverSilver alloysSoldering alloysSubstratesWettingZincTin