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Results 1-10 of 48 (Search time: 0.004 seconds).
Item hits:
Issue DateTitleAuthor(s)Supervisor(s)
2009Thermal contact at solder/substrate interfaces during solidificationNyamannavar, S.; Prabhu, K.N.-
2009Effect of substrate surface roughness on wetting behaviour of vegetable oilsPrabhu, K.N.; Fernades, P.; Kumar, G.-
2011Effect of modification melt treatment and chilling on eutectic arrest temperature and time during solidification of A357 alloyPrabhu, K.N.; Hegde, S.-
2011New polypropylene supported chitosan NF-membrane for desalination applicationPadaki, M.; Isloor, A.M.; Fernandes, J.; Prabhu, K.N.-
2012Thermal analysis and microstructure of ZA8 alloy solidifying against chillsRamesh, G.; Prabhu, K.N.-
2012Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn-0.7Cu solder alloy and copper substrateSatyanarayan; Prabhu, K.N.-
2012Assessment of heat transfer during solidification of Al-22% Si alloy by inverse analysis and surface roughness based predictive modelJayananda; Prabhu, K.N.-
2008Microhardness of laser ablated alumina coating on Ti-6A1-4VSujaya, C.; Shashikala, H.D.; Umesh, G.; Prabhu, K.N.; Hegde, S.-
2012Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperaturePrabhu, K.N.; Deshapande, P.; Satyanarayan-
2012Wetting behavior and evolution of microstructure of Sn-3.5Ag solder alloy on electroplated 304 stainless steel substratesNayak, V.U.; Prabhu, K.N.; Stanford, N.; Satyanarayan-

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