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Results 1-10 of 12 (Search time: 0.004 seconds).
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Issue DateTitleAuthor(s)Supervisor(s)
2012Thermal analysis and microstructure of ZA8 alloy solidifying against chillsRamesh, G.; Prabhu, K.N.-
2012Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn-0.7Cu solder alloy and copper substrateSatyanarayan; Prabhu, K.N.-
2012Assessment of heat transfer during solidification of Al-22% Si alloy by inverse analysis and surface roughness based predictive modelJayananda; Prabhu, K.N.-
2012Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperaturePrabhu, K.N.; Deshapande, P.; Satyanarayan-
2012Wetting behavior and evolution of microstructure of Sn-3.5Ag solder alloy on electroplated 304 stainless steel substratesNayak, V.U.; Prabhu, K.N.; Stanford, N.; Satyanarayan-
2012Equal channel angular pressing of aluminum-alumina insitu metal matrix compositeAthreya, C.N.; Mahesh, V.P.; Brahmakumar, M.; Rajan, T.P.D.; Prabhu, K.N.; Pai, B.C.; Gupta, R.K.; Ramkumar, P.-
2012Development of clay based nanofluids for quenchingRamesh, G.; Prabhu, K.N.-
2012Effect of quench probe material and section size on cooling severityRamesh, G.; Prabhu, K.N.-
2012Wetting characteristics of sn-0.7cu lead-free solder alloy on copper substratesSatyanarayan; Prabhu, K.N.-
2012Effect of addition of aluminum nanoparticles on cooling performance and quench severity of water during immersion quenchingRamesh, G.; Prabhu, K.N.-