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Results 1-10 of 14 (Search time: 0.005 seconds).
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Issue DateTitleAuthor(s)Supervisor(s)
2012Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn-0.7Cu solder alloy and copper substrateSatyanarayan; Prabhu, K.N.-
2012Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperaturePrabhu, K.N.; Deshapande, P.; Satyanarayan-
2012Wetting behavior and evolution of microstructure of Sn-3.5Ag solder alloy on electroplated 304 stainless steel substratesNayak, V.U.; Prabhu, K.N.; Stanford, N.; Satyanarayan-
2015Solder joint reliability of Sn-Cu and Sn-Ag-Cu lead-free solder alloys solidified on copper substrates with different surface roughnessesSatyanarayan; Prabhu, K.N.-
2013Wetting behavior of lead-free solders on copper substratesSatyanarayan; Prabhu, K.N.-
2012Wetting characteristics of sn-0.7cu lead-free solder alloy on copper substratesSatyanarayan; Prabhu, K.N.-
2013Spreading behavior and evolution of IMCs during reactive wetting of SAC solders on smooth and rough copper substratesSatyanarayan; Prabhu, K.N.-
2011Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface texturesSatyanarayan; Prabhu, K.N.-
2010Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface texturesSatyanarayan; Prabhu, K.N.-
2013Effect of purging gas on wetting behavior of Sn-3.5Ag lead-free solder on nickel-coated aluminum substratePrabhu, K.N.; Varun, M.; Satyanarayan-

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