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Issue Date
Title
Author(s)
Supervisor(s)
2015
Wettability and bond shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate
Tikale, S.
;
Sona, M.
;
Prabhu, K.N.
-
2016
A Computer Aided Cooling Curve Analysis method to study phase change materials for thermal energy storage applications
Sudheer, R.
;
Prabhu, K.N.
-
2016
Assessment of Joint Reliability of Sn 2.5Ag 0.5Cu Solder/Cu as a Function of Reflow Time
Sona, M.
;
Prabhu, K.N.
-
2014
Computer aided cooling curve analysis and microstructure of cerium added hypereutectic Al-Si (LM29) alloy
Vijeesh, V.
;
Prabhu, K.N.
-
2015
Comparative study of wetting and cooling performance of polymer-salt hybrid quench medium with conventional quench media
Ramesh, G.
;
Prabhu, K.N.
-
2011
Characterisation of water base copper nanoquenchants by standard cooling curve analysis
Ramesh, G.
;
Prabhu, K.N.
-
2013
Dimensionless cooling performance parameter for characterization of quench media
Ramesh, G.
;
Prabhu, K.N.
-
2016
Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates
Sona, M.
;
Prabhu, K.N.
-
2009
Investigation into creep behaviour of Sn-40%Pb alloy using impression creep method
Prasanna, H.U.
;
Udupa, K.R.
;
Prabhu, K.N.
-
2012
Effect of addition of aluminum nanoparticles on cooling performance and quench severity of water during immersion quenching
Ramesh, G.
;
Prabhu, K.N.
-
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Author
16
Ramesh, G.
14
Satyanarayan
7
Hegde, S.
7
Kumar, G.
7
Vijeesh, V.
6
Nayak, U.V.
6
Sona, M.
5
Fernandes, P.
5
Sudheer, R.
4
Nyamannavar, S.
.
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2010 - 2020
25
2000 - 2009
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1991 - 1999
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