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dc.contributor.authorAugustin, A.
dc.contributor.authorBhat, K.U.
dc.contributor.authorUdupa, K.R.
dc.contributor.authorHegde, A.C.
dc.identifier.citationMaterials Science Forum, 2015, Vol.830-831, , pp.371-374en_US
dc.description.abstractCopper thin film was deposited on double zincated aluminium using electrodeposition route. To understand the growth behavior of copper nodules, deposition was done by varying coating current density. The topography and cross section of the coating was analyzed by using SEM. The structural details of copper nodules were studied by using TEM. Deposited copper thin film was made up of pomegranate like nodules with size varying from 5 ?m to 8 ?m, varying as a function of coating current density. At higher current density, the coating was made up of multiple layers of nodules having defects like twins, dislocations and stacking faults. The nodules had fine crystallites of size in the range of 50 nm. � (2015) Trans Tech Publications, Switzerland.en_US
dc.titleElectron microscopic study of nodules formed during electrodeposition of copper on aluminiumen_US
dc.typeBook chapteren_US
Appears in Collections:2. Conference Papers

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