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DC Field | Value | Language |
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dc.contributor.author | Somayaji, B.J. | |
dc.contributor.author | Bhat, M.S. | |
dc.date.accessioned | 2020-03-30T09:58:53Z | - |
dc.date.available | 2020-03-30T09:58:53Z | - |
dc.date.issued | 2017 | |
dc.identifier.citation | Proceedings - 2016 6th International Symposium on Embedded Computing and System Design, ISED 2016, 2017, Vol., , pp.72-76 | en_US |
dc.identifier.uri | http://idr.nitk.ac.in/jspui/handle/123456789/7348 | - |
dc.description.abstract | This paper presents the design of RESURF based non-conventional LDMOS and its parametric analysis. The work investigates the impact of three primary parameters relating to p-implant, namely implant placement distance, implant doping and implant thickness, on device performance and premature avalanche breakdown. To avoid undesirable implant-drain punch-through, a boundary of limits is proposed near drain. Further, the implant parameters are optimized to maximize the ratio of Breakdown Voltage Vs On-resistance Ron to enhance the suitability of the device for High Voltage I/O applications in Sub-micron RF-SoC. A breakdown voltage of 21V at a very low Ron of 2.5k? was achieved for a device gate length of 250nm and gate oxide thickness of 5nm. � 2016 IEEE. | en_US |
dc.title | Analysis of implant parameters in high voltage TRIPLE RESURF LDMOS for advanced SoC applications | en_US |
dc.type | Book chapter | en_US |
Appears in Collections: | 2. Conference Papers |
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