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Issue Date | Title | Author(s) | Supervisor(s) |
---|---|---|---|
2019 | 3D printing of highly pure copper | Tran T.Q.; Chinnappan A.; Lee J.K.Y.; Loc N.H.; Tran L.T.; Wang G.; Kumar V.V.; Jayathilaka W.A.D.M.; Ji D.; Doddamani, M.; Ramakrishna S. | - |
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