Please use this identifier to cite or link to this item: https://idr.nitk.ac.in/jspui/handle/123456789/10808
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dc.contributor.authorNarayan, Prabhu, K.-
dc.contributor.authorRavishankar, B.N.-
dc.date.accessioned2020-03-31T08:23:06Z-
dc.date.available2020-03-31T08:23:06Z-
dc.date.issued2003-
dc.identifier.citationMaterials Science and Engineering A, 2003, Vol.360, 43862, pp.293-298en_US
dc.identifier.urihttp://idr.nitk.ac.in/jspui/handle/123456789/10808-
dc.description.abstractFor successful modelling of the solidification process, a reliable heat transfer boundary condition data is required. These boundary conditions are significantly influenced by the casting and mould parameters. In the present work, the effect of sodium modification melt treatment on casting/chill interfacial heat transfer during upward solidification of an Al-13% Si alloy against metallic chills is investigated using thermal analysis and inverse modelling techniques. In the presence of chills, modification melt treatment resulted in an increase in the cooling rate of the solidifying casting near the casting/chill interfacial region. The corresponding interfacial heat flux transients and electrical conductivities are also found to be higher. This is attributed to (i) improvement in the casting/chill interfacial thermal contact condition brought about by the decrease in the surface tension of the liquid metal on addition of sodium and (ii) increase in the electronic heat conduction in the initial solidified shell due to change in the morphology of silicon from a acicular type to a fine fibrous structure and increase in the ratio of the modification rating to the secondary dendrite arm spacing. 2003 Elsevier B.V. All rights reserved.en_US
dc.titleEffect of modification melt treatment on casting/chill interfacial heat transfer and electrical conductivity of Al-13% Si alloyen_US
dc.typeArticleen_US
Appears in Collections:1. Journal Articles

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