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Issue Date
Title
Author(s)
Supervisor(s)
2016
Assessment of Joint Reliability of Sn 2.5Ag 0.5Cu Solder/Cu as a Function of Reflow Time
Sona, M.
;
Prabhu, K.N.
-
2016
Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates
Sona, M.
;
Prabhu, K.N.
-
2014
The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn-Cu solder alloy
Sona, M.
;
Prabhu, K.N.
-
2018
Evaluation of final irrigation regimens with maleic acid for smear layer removal and wettability of root canal sealer
Ballal, N.V.
;
Ferrer-Luque, C.M.
;
Sona, M.
;
Prabhu, K.N.
;
Arias-Moliz, T.
;
Baca, P.
-
2017
The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints
Sona, M.
;
Prabhu, K.N.
-
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Arias-Moliz, T.
1
Baca, P.
1
Ballal, N.V.
1
Ferrer-Luque, C.M.
Date issued
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2016
1
2014
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2017
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2018
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