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Issue DateTitleAuthor(s)Supervisor(s)
2012Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn-0.7Cu solder alloy and copper substrateSatyanarayan; Prabhu, K.N.-
2012Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperaturePrabhu, K.N.; Deshapande, P.; Satyanarayan-
2013Spreading behavior and evolution of IMCs during reactive wetting of SAC solders on smooth and rough copper substratesSatyanarayan; Prabhu, K.N.-
2011Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface texturesSatyanarayan; Prabhu, K.N.-
2010Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface texturesSatyanarayan; Prabhu, K.N.-
2013Effect of purging gas on wetting behavior of Sn-3.5Ag lead-free solder on nickel-coated aluminum substratePrabhu, K.N.; Varun, M.; Satyanarayan-
2013Wettability of root canal sealers on intraradicular dentine treated with different irrigating solutionsBallal, N.V.; Tweeny, A.; Khechen, K.; Prabhu, K.N.; Satyanarayan; Tay, F.R.-
2014Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bondsBhat, K.N.; Prabhu, K.N.; Satyanarayan-
2019The Effect of Thermal Ageing on Solder/Substrate Interfacial Microstructures During Reflow of Sn 37Pb and Sn 3Ag 0.5CuSatyanarayan; Kumarswamy, M.C.; Prabhu, K.N.-
2011Wetting behaviour and interfacial microstructure of Sn-Ag-Zn solder alloys on nickel coated aluminium substratesSatyanarayan; Prabhu, K.N.-

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