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Issue Date
Title
Author(s)
Supervisor(s)
2016
Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates
Sona, M.
;
Prabhu, K.N.
-
2012
Effect of addition of aluminum nanoparticles on cooling performance and quench severity of water during immersion quenching
Ramesh, G.
;
Prabhu, K.N.
-
2015
Effect of chilling and cerium addition on microstructure and cooling curve parameters of Al-14%Si alloy
Vijayan, V.
;
Prabhu, K.N.
-
2014
Cooling performance of select mineral oil and polymer quenchants
Tiwary, V.
;
Prabhu, K.N.
-
2013
Comparison of spreading behaviour and interfacial microstructure in Sn-0 7Cu, Sn-0 3Ag-0 7Cu and Sn-2 5Ag-0 5Cu lead free solder alloys on Fe-42Ni substrate
Narayan, S.
;
Prabhu, K.N.
-
2011
Comparison of Grossmann and lumped heat capacitance methods for assessment of heat transfer characteristics of quench media
Prabhu, K.N.
;
Ali, I.
-
2013
The effect of addition of copper nanoparticles on wetting behaviour of water during immersion quenching
Ramesh, G.
;
Prabhu, K.N.
-
2014
The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn-Cu solder alloy
Sona, M.
;
Prabhu, K.N.
-
2018
The effect of Sr modification on thermal diffusivity of Al 8Si alloy
Vijayan, V.
;
Prabhu, K.N.
-
2016
The effect of simultaneous refinement and modification by cerium on microstructure and mechanical properties of Al-8% Si alloy
Vijayan, V.
;
Prabhu, K.N.
-
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3
Tikale, S.
3
Vijayan, V.
3
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Ballal, N.V.
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