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Results 31-40 of 80 (Search time: 0.005 seconds).
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Issue DateTitleAuthor(s)Supervisor(s)
2010Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface texturesSatyanarayan; Prabhu, K.N.-
2013Effect of purging gas on wetting behavior of Sn-3.5Ag lead-free solder on nickel-coated aluminum substratePrabhu, K.N.; Varun, M.; Satyanarayan-
2013Wettability of root canal sealers on intraradicular dentine treated with different irrigating solutionsBallal, N.V.; Tweeny, A.; Khechen, K.; Prabhu, K.N.; Satyanarayan; Tay, F.R.-
1991Heat flux transients at the casting/chill interface during solidification of aluminum base alloysKumar, T.S.P.; Prabhu, K.N.-
2010Determination of spread activation energy and assessment of wetting behavior of solders on metallic substratesPrabhu, K.N.; Kumar, G.-
2018Evaluation of final irrigation regimens with maleic acid for smear layer removal and wettability of root canal sealerBallal, N.V.; Ferrer-Luque, C.M.; Sona, M.; Prabhu, K.N.; Arias-Moliz, T.; Baca, P.-
2013Solder joint reliability of Sn-0 7Cu and Sn-0 3Ag- 0 7Cu lead-free solder alloys solidified on copper substrates with different surface roughnessesSatyanarayan, S.; Prabhu, K.N.-
2014Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bondsBhat, K.N.; Prabhu, K.N.; Satyanarayan-
2014Two Parameter Weibull Analysis of the Effect of Chemical Modification of Al�7si�0.3�Mg Alloy on Ultimate Tensile StrengthRaghunathan, R.; Prabhu, K.N.; Hegde, T.G.-
2011Wetting behavior of soldersKumar, G.; Prabhu, K.N.-

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