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Issue Date | Title | Author(s) | Supervisor(s) |
---|---|---|---|
2014 | Studies on Wetting Behaviour, Microstructure Evolution and Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-free Solders | Satyanarayan | Prabhu, K Narayana. |
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- 1 shear force
- 1 solder
- 1 Wetting
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