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Issue Date | Title | Author(s) | Supervisor(s) |
---|---|---|---|
2017 | Effect of reflow time on wetting kinetics, microstructure and joint strength of Sn-Cu and Sn-Ag-Cu solders | Sona, Mrunali | Narayan Prabhu, K. |
2021 | Performance and Reliability of Nanoparticles Reinforced Lead-Free Solder Joints – A Study | Tikale, Sanjay Vinayak. | Prabhu, K Narayan. |
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