Browsing by Author Venkataraman, N.
Showing results 1 to 4 of 4
|2005||Casting/mold thermal contact heat transfer during solidification of Al-Cu-Si alloy (LM 21) plates in thick and thin molds||Prabhu, K.N.; Chowdary, B.; Venkataraman, N.||-|
|1994||Effect of microstructure on the fatigue strength of an austempered ductile iron||Shanmugam, P.; Prasad, Rao, P.; Rajendra, Udupa, K.; Venkataraman, N.||-|
|2002||Effect of thermal contact conductance on the solidification of a Pb-Sn solder alloy||Narayan, Prabhu, K.; Kumar, S.T.; Venkataraman, N.||-|
|2002||Heat transfer at the metal/substrate interface during solidification of Pb-Sn solder alloys||Prabhu, K.N.; Kumar, S.T.; Venkataraman, N.||-|