Browsing by Author Sona, M.
Showing results 1 to 11 of 11
| Issue Date | Title | Author(s) | Supervisor(s) |
| 2016 | Assessment of Joint Reliability of Sn 2.5Ag 0.5Cu Solder/Cu as a Function of Reflow Time | Sona, M.; Prabhu, K.N. | - |
| 2017 | Effect of cooling rate on joint shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate | Tikale, S.; Sona, M.; Narayan, Prabhu, K. | - |
| 2014 | The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn-Cu solder alloy | Sona, M.; Prabhu, K.N. | - |
| 2016 | Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates | Sona, M.; Prabhu, K.N. | - |
| 2017 | The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints | Sona, M.; Prabhu, K.N. | - |
| 2017 | Effects of smear layer removal agents on the physical properties and microstructure of mineral trioxide aggregate cement | Ballal, N.V.; Sona, M.; Tay, F.R. | - |
| 2018 | Evaluation of final irrigation regimens with maleic acid for smear layer removal and wettability of root canal sealer | Ballal, N.V.; Ferrer-Luque, C.M.; Sona, M.; Prabhu, K.N.; Arias-Moliz, T.; Baca, P. | - |
| 2015 | Spreading Behaviour and Joint Reliability of Sn 0.3Ag 0.7Cu Lead-Free Solder Alloy on Nickel Coated Copper Substrate as a Function of Reflow Time | Sona, M.; Narayan, Prabhu, K. | - |
| 2015 | Wettability and bond shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate | Tikale, S.; Sona, M.; Prabhu, K.N. | - |
| 2019 | Wettability, Interfacial Intermetallic Growth and Joint Shear Strength of Eutectic Sn�Cu Solder Reflowed on Bare and Nickel-Coated Copper Substrates | Sona, M.; Tikale, S.; Prabhu, N. | - |
| 2015 | Wetting kinetics and joint strength of Sn-0.3Ag-0.7Cu lead-free solder alloy on copper substrate as a function of reflow time | Sona, M.; Narayan, Prabhu, K. | - |
