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Browsing by Author Tikale, S.

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Issue Date	Title	Author(s)	Supervisor(s)
2018	Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles	Tikale, S.; Prabhu, K.N.	-
2015	Wettability and bond shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate	Tikale, S.; Sona, M.; Prabhu, K.N.	-
2019	Wettability, Interfacial Intermetallic Growth and Joint Shear Strength of Eutectic Sn�Cu Solder Reflowed on Bare and Nickel-Coated Copper Substrates	Sona, M.; Tikale, S.; Prabhu, N.	-

Showing results 6 to 8 of 8 < previous