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Browsing by Author Sona, M.
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Showing results 2 to 11 of 11
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Issue Date
Title
Author(s)
Supervisor(s)
2017
Effect of cooling rate on joint shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate
Tikale, S.
;
Sona, M.
;
Narayan, Prabhu, K.
-
2014
The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn-Cu solder alloy
Sona, M.
;
Prabhu, K.N.
-
2016
Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates
Sona, M.
;
Prabhu, K.N.
-
2017
The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints
Sona, M.
;
Prabhu, K.N.
-
2017
Effects of smear layer removal agents on the physical properties and microstructure of mineral trioxide aggregate cement
Ballal, N.V.
;
Sona, M.
;
Tay, F.R.
-
2018
Evaluation of final irrigation regimens with maleic acid for smear layer removal and wettability of root canal sealer
Ballal, N.V.
;
Ferrer-Luque, C.M.
;
Sona, M.
;
Prabhu, K.N.
;
Arias-Moliz, T.
;
Baca, P.
-
2015
Spreading Behaviour and Joint Reliability of Sn 0.3Ag 0.7Cu Lead-Free Solder Alloy on Nickel Coated Copper Substrate as a Function of Reflow Time
Sona, M.
;
Narayan, Prabhu, K.
-
2015
Wettability and bond shear strength of Sn-9Zn lead-free solder alloy reflowed on copper substrate
Tikale, S.
;
Sona, M.
;
Prabhu, K.N.
-
2019
Wettability, Interfacial Intermetallic Growth and Joint Shear Strength of Eutectic Sn�Cu Solder Reflowed on Bare and Nickel-Coated Copper Substrates
Sona, M.
;
Tikale, S.
;
Prabhu, N.
-
2015
Wetting kinetics and joint strength of Sn-0.3Ag-0.7Cu lead-free solder alloy on copper substrate as a function of reflow time
Sona, M.
;
Narayan, Prabhu, K.
-