Browsing by Author Prabhu, K.N.

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Issue DateTitleAuthor(s)Supervisor(s)
2012Effect of addition of aluminum nanoparticles on cooling performance and quench severity of water during immersion quenchingRamesh, G.; Prabhu, K.N.-
2015The Effect of Addition of Ce and Sr on the Solidification Path of Al 8Si 2Cu AlloyVijeesh, V.; Prabhu, K.N.-
2013The effect of addition of copper nanoparticles on wetting behaviour of water during immersion quenchingRamesh, G.; Prabhu, K.N.-
2016Effect of Ce melt treatment on solidification path of ZA8 alloySudheer, R.; Vijeesh, V.; Prabhu, K.N.-
2016Effect of cerium addition on casting/chill interfacial heat flux and casting surface profile during solidification of Al-14%Si alloyVijeesh, V.; Prabhu, K.N.-
2003Effect of chill thickness and superheat on casting/chill interfacial heat transfer during solidification of commercially pure aluminiumGafur, M.A.; Haque, M.N.; Prabhu, K.N.-
2015Effect of chilling and cerium addition on microstructure and cooling curve parameters of Al-14%Si alloyVijayan, V.; Prabhu, K.N.-
2015The effect of cooling rate and cerium melt treatment on thermal analysis parameters and microstructure of hypoeutectic Al-Si alloyVijeesh, V.; Prabhu, K.N.-
2012Effect of cooling rate during solidification of Sn-9Zn lead-free solder alloy on its microstructure, tensile strength and ductile-brittle transition temperaturePrabhu, K.N.; Deshapande, P.; Satyanarayan-
2012Effect of Mn on cooling behaviour and microstructure of chill cast Zn-Al (ZA8) alloyRamesh, G.; Vishwanath, H.M.; Prabhu, K.N.-
2011Effect of modification melt treatment and chilling on eutectic arrest temperature and time during solidification of A357 alloyPrabhu, K.N.; Hegde, S.-
2018Effect of Multiple Reflow Cycles and Al2O3 Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder AlloyTikale, S.; Prabhu, K.N.-
2013Effect of purging gas on wetting behavior of Sn-3.5Ag lead-free solder on nickel-coated aluminum substratePrabhu, K.N.; Varun, M.; Satyanarayan-
2012Effect of quench probe material and section size on cooling severityRamesh, G.; Prabhu, K.N.-
2014Effect of reflow temperature and substrate roughness on wettability, IMC growth and shear strength of SAC387/Cu bondsBhat, K.N.; Prabhu, K.N.; Satyanarayan-
2014The effect of reflow time on reactive wetting, evolution of interfacial IMCs and shear strength of eutectic Sn-Cu solder alloySona, M.; Prabhu, K.N.-
2016Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper SubstratesSona, M.; Prabhu, K.N.-
2007Effect of section size and agitation on heat transfer during quenching of AISI 1040 steelFernandes, P.; Prabhu, K.N.-
2006Effect of section thickness and modification on thermal analysis parameters of A357 alloyHegde, S.; Kumar, G.; Prabhu, K.N.-
2018Effect of section thickness on heat transfer during quenching in vegetable oilsNayak, U.V.; Prabhu, K.N.-