Experimental study on forced convective and subcooled flow boiling heat transfer coefficient of water-ethanol mixtures: an application in cooling of heat dissipative devices

dc.contributor.authorSuhas, B.G.
dc.contributor.authorSathyabhama, A.
dc.date.accessioned2020-03-31T08:30:55Z
dc.date.available2020-03-31T08:30:55Z
dc.date.issued2018
dc.description.abstractThe experimental study is carried out to determine forced convective and subcooled flow boiling heat transfer coefficient in conventional rectangular channels. The fluid is passed through rectangular channels of 0.01 m depth, 0.01 m width, and 0.15 m length. The parameters varied are heat flux, mass flux, inlet temperature and volume fraction of ethanol. Forced convective heat transfer coefficient increases with increase in heat flux and mass flux, but effect of mass flux is less significant. Subcooled flow boiling heat transfer increases with increase in heat flux and mass flux, but the effect of heat flux is dominant. During the subcooled flow boiling region, the effect of mass flux will not influence the heat transfer. The strong Marangoni effect will increase the heat transfer coeffient for mixture with 25% ethanol volume fraction. The results obtained for subcooled flow boiling heat transfer coefficient of water are compared with available literature correlations. It is found that Liu-Winterton equation predicts the experimental results better when compared with that of other literature correlations. An empirical correlation for subcooled flow boiling heat transfer coefficient as a function of mixture wall super heat, mass flux, volume fractions and inlet temperature is developed from the experimental results. 2017, Springer-Verlag GmbH Germany.en_US
dc.identifier.citationHeat and Mass Transfer/Waerme- und Stoffuebertragung, 2018, Vol.54, 2, pp.277-290en_US
dc.identifier.urihttps://idr.nitk.ac.in/handle/123456789/11210
dc.titleExperimental study on forced convective and subcooled flow boiling heat transfer coefficient of water-ethanol mixtures: an application in cooling of heat dissipative devicesen_US
dc.typeArticleen_US

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