Investigation of CMOS Based Integration Approach Using DAI Technique for Next Generation Wireless Networks

dc.contributor.authorRoy, G.M.
dc.contributor.authorKanuajia, B.K.
dc.contributor.authorDwari, S.
dc.contributor.authorKumar, S.
dc.contributor.authorSong, H.
dc.date.accessioned2026-02-05T09:30:25Z
dc.date.issued2019
dc.description.abstractThis research work investigates a CMOS based low noise amplifier (LNA) using differential active inductor with eight-shaped patch antenna for next generation wireless communication. The proposed work conceded into three different phases. The first phase proposes LNA architecture which includes multistage cascode amplifier with a gate inductor gain peaking technique. The ground approach for this architecture employs active inductor technique that includes two stages of differential amplifier. The proposed novel technique leads to give incremental in inductance by using of common mode feedback resistor and lowers the undesirable parasitic resistance effect. Additionally, this technique offers gain enhanced noise cancellation and achieves a frequency band of around 5.7 GHz. The proposed architecture includes single stage differential AI and enhances the bandwidth up to 6.8 GHz with peak gain of 21 dB at 7.8 GHz. The noise figure and stability factor are achieved which is reasonably good at 1 dB. The proposed architecture is design and optimized on advanced design RF simulator using 0.045 µm CMOS process technology. While in second phase, a narrow band eight-shaped patch antenna is designed which provides operating band range from 5.8 to 6.5 GHz with 6.2 GHz resonating frequency. Highest peak gain of 15 dB and maximum radiation power of 42.5 dBm is succeed by proposed antenna. The final phase provides integration strategy of LNA with antenna and achieves desired gain of nearly 21 dB with minimum NF of 1.2–1.5 dB in the same band. © 2018, Springer Science+Business Media, LLC, part of Springer Nature.
dc.identifier.citationWireless Personal Communications, 2019, 104, 3, pp. 1091-1107
dc.identifier.issn9296212
dc.identifier.urihttps://doi.org/10.1007/s11277-018-6069-7
dc.identifier.urihttps://idr.nitk.ac.in/handle/123456789/24688
dc.publisherSpringer New York LLC barbara.b.bertram@gsk.com
dc.subjectArchitecture
dc.subjectCascode amplifiers
dc.subjectCMOS integrated circuits
dc.subjectDifferential amplifiers
dc.subjectElectric inductors
dc.subjectHeterojunction bipolar transistors
dc.subjectIntegrated circuit design
dc.subjectMetals
dc.subjectMicrostrip antennas
dc.subjectMicrowave antennas
dc.subjectMOS devices
dc.subjectNetwork architecture
dc.subjectNext generation networks
dc.subjectNoise figure
dc.subjectOxide semiconductors
dc.subjectSlot antennas
dc.subjectWireless networks
dc.subjectWireless telecommunication systems
dc.subjectCMOS process technology
dc.subjectComplementary metal oxide semiconductors
dc.subjectDifferential active inductors
dc.subjectIntegration strategy
dc.subjectNext-generation wireless communications
dc.subjectNext-generation wireless network
dc.subjectParasitic resistances
dc.subjectProposed architectures
dc.subjectLow noise amplifiers
dc.titleInvestigation of CMOS Based Integration Approach Using DAI Technique for Next Generation Wireless Networks

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