Wettability, Interfacial Intermetallic Growth and Joint Shear Strength of Eutectic Sn–Cu Solder Reflowed on Bare and Nickel-Coated Copper Substrates

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dc.contributor.authorSona, M.
dc.contributor.authorTikale, S.
dc.contributor.authorPrabhu, N.
dc.date.accessioned2026-02-05T09:30:00Z
dc.date.issued2019
dc.description.abstractIn the present study, wettability, interfacial intermetallic growth and shear strength of Sn–Cu eutectic solder solidified on bare as well as nickel-coated copper substrates were examined. Sn–0.7Cu solder was reflowed over the substrate for reflow times ranging from 10 to 500 s at 270 °C. Samples were cooled by quenching in water. The wetting behavior was similar on both the substrates. The corresponding time period to the end of gravity zone (T<inf>gz</inf>) was measured from the relaxation curve obtained from wetting studies. T<inf>gz</inf> was found to be 25 s for Sn–0.7Cu on bare and 50 s on Ni-coated copper substrates. The intermetallic compound layer thickness was fitted to a growth model to study the growth kinetics. The integrity of solder/substrate joint was assessed by performing ball as well as single-lap joint shear tests. The shear strength was found to be maximum at T<inf>gz</inf> for all solder/substrate systems. © 2019, The Indian Institute of Metals - IIM.
dc.identifier.citationTransactions of the Indian Institute of Metals, 2019, 72, 6, pp. 1579-1583
dc.identifier.issn9722815
dc.identifier.urihttps://doi.org/10.1007/s12666-019-01568-5
dc.identifier.urihttps://idr.nitk.ac.in/handle/123456789/24516
dc.publisherSpringer
dc.subjectContact angle
dc.subjectGravity zone
dc.subjectIntermetallic compound
dc.subjectJoint strength
dc.subjectWettability
dc.titleWettability, Interfacial Intermetallic Growth and Joint Shear Strength of Eutectic Sn–Cu Solder Reflowed on Bare and Nickel-Coated Copper Substrates

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